⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11526651 | 1.00 | — | — | |
| SCHEMBL27781773 | 0.87 | — | — | |
| SCHEMBL28256418 | 0.87 | — | — | |
| SCHEMBL28341568 | 0.87 | — | — | |
| SCHEMBL4824203 | 0.87 | — | — | |
| SCHEMBL28338161 | 0.87 | — | — | |
| SCHEMBL1352912 | 0.87 | — | — | |
| SCHEMBL28085483 | 0.87 | — | — | |
| SCHEMBL17868302 | 0.87 | — | — | |
| Water SCHEMBL2845482 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7786605-B2 | Stacked semiconductor components with through wire interconnects (TWI) | MICRON TECHNOLOGY, INC. (US) | 2010-08-31 | — | — | US | claimed |
| US-20080042247-A1 | Stacked Semiconductor Components With Through Wire Interconnects (TWI) | MICRON SEMICONDUCTOR PRODUCTS, INC. | 2008-02-21 | — | — | US | claimed |
| JP-62025120-A | — | — | None | — | — | JP | disclosed |
| US-12014965-B2 | Three-dimensional packaging structure and method for fan-out of bonding wall of device | XIAMEN SKY SEMICONDUCTOR TECHNOLOGY CO. LTD. (CN) | 2024-06-18 | — | — | US | disclosed |
| CN-117374002-A | Gold-aluminum interconnection transmission line and preparation method thereof | 中国电子科技集团公司第十三研究所 | 2024-01-09 | — | — | CN | disclosed |
| CN-116544112-A | Transistor manufacturing method and transistor | 中国科学院微电子研究所 | 2023-08-04 | — | — | CN | disclosed |
| WO-2023122965-A1 | DRIVING PANEL AND DISPLAY DEVICE | 厦门市芯颖显示科技有限公司 | 2023-07-06 | — | — | WO | disclosed |
| WO-2023092568-A1 | SOLID-STATE LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | 厦门市芯颖显示科技有限公司 | 2023-06-01 | — | — | WO | disclosed |
| WO-2023092573-A1 | WHITE LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS | 厦门市芯颖显示科技有限公司 | 2023-06-01 | — | — | WO | disclosed |
| WO-2023092569-A1 | WHITE LIGHT EMITTING DEVICE AND COLOR DISPLAY APPARATUS | 厦门市芯颖显示科技有限公司 | 2023-06-01 | — | — | WO | disclosed |
| CN-113388759-B | Heat-resistant aluminum alloy powder and preparation method thereof, and aluminum alloy formed part and preparation method thereof | 燕山大学 | 2022-07-19 | — | — | CN | disclosed |
| US-7307348-B2 | Semiconductor components having through wire interconnects (TWI) | MICRON TECHNOLOGY, INC. (US) | 2007-12-11 | — | — | US | disclosed |
| WO-2007133302-A2 | SEMICONDUCTOR COMPONENTS AND SYSTEMS HAVING ENCAPSULATED THROUGH WIRE INTERCONNECTS (TWI) AND WAFER LEVEL METHODS OF FABRICATION | MICRON TECHNOLOGY, INC. (US) | 2007-11-22 | — | — | WO | disclosed |
| US-20070246819-A1 | Semiconductor components and systems having encapsulated through wire interconnects (TWI) and wafer level methods of fabrication | MICRON TECHNOLOGY, INC. | 2007-10-25 | — | — | US | disclosed |
| US-20070167000-A1 | Methods and systems for fabricating semiconductor components with through wire interconnects (TWI) | MICRON SEMICONDUCTOR PRODUCTS, INC. | 2007-07-19 | — | — | US | disclosed |
| US-20070126091-A1 | Semiconductor components having through wire interconnects (TWI) | MICRON TECHNOLOGY, INC. | 2007-06-07 | — | — | US | disclosed |
| US-20060255420-A1 | Front illuminated back side contact thin wafer detectors | OSI OPTOELECTRONICS, INC. | 2006-11-16 | — | — | US | disclosed |
| US-7057254-B2 | Front illuminated back side contact thin wafer detectors | UDT SENSORS, INC. (US) | 2006-06-06 | — | — | US | disclosed |
| US-20040222482-A1 | Front illuminated back side contact thin wafer detectors | OSI OPTOELECTRONICS, INC. | 2004-11-11 | — | — | US | disclosed |
| JP-S6225120-A | ELECTRODE USED IN ELECTROLYTIC POLYMERIZATION OF ELECTRICALLY CONDUCTIVE POLYMER AND DEVELOPMENT OF FUNCTIONALLY THEREOF | OMRON TATEISI ELECTRONICS CO | 1987-02-03 | — | — | JP | disclosed |