⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29018316 | 0.89 | — | — | |
| SCHEMBL28220895 | 0.87 | — | — | |
| SCHEMBL455745 | 0.87 | — | — | |
| SCHEMBL1672678 | 0.87 | — | — | |
| SCHEMBL81562 | 0.87 | — | — | |
| SCHEMBL31678966 | 0.87 | — | — | |
| SCHEMBL11526651 | 0.87 | — | — | |
| SCHEMBL28854330 | 0.87 | — | — | |
| SCHEMBL10904997 | 0.87 | — | — | |
| Phosphine SCHEMBL15455959 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-209880659-U | Wafer-level packaging structure of filter | 厦门云天半导体科技有限公司 | 2019-12-31 | — | — | CN | claimed |
| US-20250285998-A1 | PAD METALLIZATION SYSTEMS AND RELATED METHODS | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (US) | 2025-09-11 | — | — | US | disclosed |
| US-20250286001-A1 | PAD METALLIZATION SYSTEMS AND RELATED METHODS | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (US) | 2025-09-11 | — | — | US | disclosed |
| US-20250279377-A1 | COPPER PAD INTERCONNECT SYSTEMS AND RELATED METHODS | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (US) | 2025-09-04 | — | — | US | disclosed |
| CN-112652573-A | Packaging method and chip | 海光信息技术股份有限公司 | 2021-04-13 | — | — | CN | disclosed |
| CN-210200699-U | Three-dimensional packaging structure of bonded wall fan-out device | Xiamen Sky Semiconductor Technology Co., Ltd. | 2020-03-27 | — | — | CN | disclosed |
| CN-110877892-A | Device packaging structure with cavity and method | 厦门云天半导体科技有限公司 | 2020-03-13 | — | — | CN | disclosed |
| CN-110729255-A | Three-dimensional packaging structure and method for bonding wall fan-out device | 厦门云天半导体科技有限公司 | 2020-01-24 | — | — | CN | disclosed |
| CN-209880659-U | Wafer-level packaging structure of filter | 厦门云天半导体科技有限公司 | 2019-12-31 | — | — | CN | disclosed |