SCHEMBL4580458

SCHEMBL4580458

C=CC(=O)OCCC(CCOC(=O)C=C)(COCCCCC(C)OC(=O)C=C)n1c(=O)[nH]c(=O)[nH]c1=O

nearest known ligand 0.34

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.34
TSHR P16473 2/20 0.32
ALDH1A1 P00352 1/20 0.32
CYP3A4 P08684 1/20 0.32
HPGD P15428 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4580460 0.78 TSHR (0.32) TSHRALDH1A1CYP3A4HPGD
SCHEMBL6905749 0.78 THRB (0.36) THRBTSHRALDH1A1CYP3A4HPGD
SCHEMBL29011047 0.77
SCHEMBL152168 0.75 TSHR (0.41) THRBTSHRALDH1A1CYP3A4HPGD
SCHEMBL1262710 0.73
SCHEMBL6731836 0.73 TSHR (0.60) THRBTSHRALDH1A1CYP3A4HPGD
SCHEMBL13834296 0.72 TSHR (0.30) TSHR
SCHEMBL10867522 0.72 TSHR (0.63) THRBTSHRALDH1A1CYP3A4HPGD
SCHEMBL29845548 0.72 TSHR (0.63) THRBTSHRALDH1A1CYP3A4HPGD
SCHEMBL31636154 0.72 TSHR (0.63) THRBTSHRALDH1A1CYP3A4HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0298448-B1 Radiation-curable adhesive tape FURUKAWA ELECTRIC CO LTD (JP) 1994-06-29 EP claimed
US-7906582-B2 Polymerizable composition, tacky material, and adhesive FUJIFILM CORPORATION (JP) 2011-03-15 US disclosed
US-20080199691-A1 POLYMERIZABLE COMPOSITION, TACKY MATERIAL, AND ADHESIVE FUJIFILM CORPORATION (JP) 2008-08-21 US disclosed
EP-0298448-B1 Radiation-curable adhesive tape FURUKAWA ELECTRIC CO LTD (JP) 1994-06-29 EP disclosed
US-5300172-A Applying pressure sensitive adhesive tape on etchable plate, radiating; reduction of adhesive force THE FURUKAWA ELECTRIC CO., LTD. (JP) 1994-04-05 US disclosed
EP-0539973-A2 A surface-protection method during etching THE FURUKAWA ELECTRIC CO., LTD. (JP) 1993-05-05 EP disclosed