Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALOX15 | P16050 | 5/20 | 0.59 |
| ▸ | ESR1 | P03372 | 3/20 | 0.44 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.44 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.42 |
| ▸ | TYR | P14679 | 3/20 | 0.41 |
| ▸ | ALOX5 | P09917 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | LMNA | P02545 | 2/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.41 |
| ▸ | CA12 | O43570 | 2/20 | 0.41 |
| ▸ | CA1 | P00915 | 2/20 | 0.41 |
| ▸ | CA2 | P00918 | 2/20 | 0.41 |
| ▸ | CA9 | Q16790 | 2/20 | 0.41 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.41 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.41 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.41 |
| ▸ | MIF | P14174 | 1/20 | 0.41 |
| ▸ | HTT | P42858 | 1/20 | 0.41 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.41 |
| ▸ | MAOB | P27338 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL48156 | 0.97 | — | — | |
| SCHEMBL29457568 | 0.97 | — | — | |
| Hydroquinone SCHEMBL11038247 | 0.94 | ALOX15 (0.59) | ALOX15ESR1ESR2ALOX12TYR | |
| SCHEMBL28818607 | 0.94 | ALOX15 (0.59) | ALOX15ESR1ESR2ALOX12TYR | |
| Methane SCHEMBL10390506 | 0.94 | ALOX15 (0.59) | ALOX15ESR1ESR2ALOX12TYR | |
| Ethane SCHEMBL27660209 | 0.92 | ALOX15 (0.56) | ALOX15ESR1ESR2ALOX12TYR | |
| Methoxymethane SCHEMBL11012839 | 0.87 | ALOX15 (0.52) | ALOX15ESR1ESR2ALOX12TYR | |
| SCHEMBL27680202 | 0.85 | ALOX15 (0.50) | ALOX15ESR1ESR2ALOX12TYR | |
| SCHEMBL10390504 | 0.80 | ALOX15 (0.45) | ALOX15ESR1ESR2ALOX12TYR | |
| SCHEMBL28217340 | 0.79 | MAOB (0.44) | ALOX15ESR1ESR2ALOX12TYR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113396056-B | Dry film for hollow device, cured product, and electronic component | 太阳控股株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-118019817-A | Sheet-like curable adhesive and optical member | 琳得科株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117882007-A | Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board | 株式会社力森诺科 | 2024-04-12 | — | — | CN | disclosed |
| CN-117859095-A | Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board | 株式会社力森诺科 | 2024-04-09 | — | — | CN | disclosed |
| CN-111505905-B | Dry film, cured product, and electronic component | 太阳控股株式会社 | 2024-03-12 | — | — | CN | disclosed |
| CN-113195584-B | Curable resin composition, dry film, resin-coated copper foil, cured product, and electronic component | 太阳控股株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-113646399-B | Sheet-like adhesive, sealing sheet, electronic device sealing body, and method for manufacturing electronic device sealing body | 琳得科株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-117044390-A | Wiring sheet for three-dimensional molding | 琳得科株式会社 | 2023-11-10 | — | — | CN | disclosed |
| CN-111955053-B | Electronic device sealing body, sheet-like adhesive, and adhesive film for sealing electronic device | 琳得科株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-112088185-B | Resin composition, sealing sheet, and sealing body | 琳得科株式会社 | 2023-09-26 | — | — | CN | disclosed |
| WO-2007066816-A1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION SOLUTION, FILM FORMING MATERIAL AND THEIR CURED PRODUCT | SHOWA DENKO K.K. (JP) | 2007-06-14 | — | — | WO | disclosed |
| WO-2007043536-A9 | HEAT-CURABLE RESIN COMPOSITION INCLUDING SILICONE POWDER | SHOWA DENKO KK (JP) | 2007-06-07 | — | — | WO | disclosed |
| WO-2007043536-A2 | HEAT-CURABLE RESIN COMPOSITION INCLUDING SILICONE POWDER | SHOWA DENKO K.K. (JP) | 2007-04-19 | — | — | WO | disclosed |
| EP-1759244-A2 | PHOTOSENSITIVE RESIN COMPOSITION, AND CURED PRODUCT AND USE THEREOF | SHOWA DENKO KABUSHIKI KAISHA (JP) | 2007-03-07 | — | — | EP | disclosed |
| WO-2006123804-A1 | CARBOXYL GROUP-CONTAINING POLYURETHANE, HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF | SHOWA DENKO K.K. (JP) | 2006-11-23 | — | — | WO | disclosed |
| EP-1687678-A2 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION METHOD OF FORMING CURED ARTICLE AND METHOD OF PRODUCING FUNCTIONAL DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-08-09 | — | — | EP | disclosed |
| WO-2006054791-A1 | RESIN CURED FILM FOR FLEXIBLE PRINTED WIRING BOARD AND PRODUCTION PROCESS THEREOF | SHOWA DENKO K.K. (JP) | 2006-05-26 | — | — | WO | disclosed |
| CN-1755524-A | Photosensitive thermosetting resin composition, resist-coated printed wiring board, and method for producing same | YAMASAKA CHEMICAL CO LTD (JP) | 2006-04-05 | — | — | CN | disclosed |
| WO-2005116760-A2 | PHOTOSENSITIVE RESIN COMPOSITION, AND CURED PRODUCT AND USE THEREOF | SHOWA DENKO K.K. (JP) | 2005-12-08 | — | — | WO | disclosed |
| WO-2005052688-A2 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION METHOD OF FORMING CURED ARTICLE AND METHOD OF PRODUCING FUNCTIONAL DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-06-09 | — | — | WO | disclosed |