Biphenyl

Biphenyl

SCHEMBL459042

NON.c1ccc(-c2ccccc2)cc1

nearest known ligand 0.69

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.69
TAAR1 Q96RJ0 2/20 0.56
HSD17B10 Q99714 2/20 0.56
CYP3A4 P08684 1/20 0.56
TDP1 Q9NUW8 1/20 0.56
AGXT P21549 3/20 0.55
IDO1 P14902 3/20 0.55
MAOA P21397 1/20 0.48
MAPK1 P28482 2/20 0.47
CYP1A2 P05177 1/20 0.47
NOTUM Q6P988 1/20 0.47
MMP3 P08254 1/20 0.47
BCL2L1 Q07817 1/20 0.47
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
CA9 Q16790 2/20 0.44
AKT1 P31749 1/20 0.43
AKT2 P31751 1/20 0.43
CA12 O43570 1/20 0.43
WDR5 P61964 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Biphenyl SCHEMBL27291982 1.00 ALDH1A1 (0.69) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
Biphenyl SCHEMBL7705173 0.86 ALDH1A1 (0.60) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
Biphenyl SCHEMBL2574161 0.84 ALDH1A1 (0.82) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
SCHEMBL30629023 0.83 ALDH1A1 (1.00) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
Biphenyl SCHEMBL1358618 0.83 ALDH1A1 (1.00) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
Biphenyl SCHEMBL4002609 0.83 ALDH1A1 (1.00) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
Biphenyl SCHEMBL164 0.83 ALDH1A1 (1.00) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
Biphenyl SCHEMBL28890607 0.83 ALDH1A1 (1.00) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
SCHEMBL29560186 0.83 ALDH1A1 (1.00) ALDH1A1TAAR1HSD17B10CYP3A4TDP1
Biphenyl SCHEMBL2548048 0.83 ALDH1A1 (1.00) ALDH1A1TAAR1HSD17B10CYP3A4TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 486 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12362346-B2 Solution-phase deposition of thin films on conversion anodes in lithium-ion batteries CORESHELL TECHNOLOGIES, INCORPORATED (US) 2025-07-15 US claimed
US-11961991-B2 Solution-phase deposition of thin films on solid-state electrolytes CORESHELL TECHNOLOGIES, INCORPORATED (US) 2024-04-16 US claimed
US-11929482-B2 2024-03-12 US claimed
CN-117625105-A Epoxy resin adhesive and preparation method and application thereof 韦尔通科技股份有限公司 2024-03-01 CN claimed
US-11894543-B2 2024-02-06 US claimed
US-20230317919-A1 DEPOSITION OF FILMS ONTO BATTERY MATERIAL POWDERS CORESHELL TECHNOLOGIES, INC. 2023-10-05 US claimed
CN-111574674-B Flow pattern regulator for oil-based drilling fluid and preparation method thereof 北京中科日升科技有限公司 2023-09-19 CN claimed
EP-4205193-A1 DEPOSITION OF FILMS ONTO BATTERY MATERIAL POWDERS Coreshell Technologies, Inc. (US) 2023-07-05 EP claimed
CN-115678287-A Preparation and application of high-temperature-resistant epoxy resin 台州市黄岩区武汉理工高性能复合材料技术研究院 2023-02-03 CN claimed
EP-4062470-A1 SOLUTION-PHASE DEPOSITION OF THIN FILMS ON SOLID-STATE ELECTROLYTES Coreshell Technologies, Inc. (US) 2022-09-28 EP claimed
US-5693745-A COATING GLASS SURFACE WITH POLYAMIC ACID SOLUTIOM, IMIDATION, THEN VACUUM METALLIZATION AND DEPOSITION OF AMORPHOUS SILICON FILM, TRANSPARENT ELECTRODE AND PROTECTIVE FILM, AND FINALLY PEELING POLYIMIDE FILM FROM GLASS SUBSTRATE INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 1997-12-02 US claimed
US-5637359-A POLYIMIDE ALIGNING FILM IS FORMED BY DISSOLVING HIGH TEMPERATURE SINTERING POLYIMIDE IN SOLVENT, PRINTING RESULTING SOLUTION IN A SUBSTRATE AND REMOVING SOLVENT BY HEATING OR HEATING UNDER REDUCED PRESSURE SHARP KABUSHIKI KAISHA (JP) 1997-06-10 US claimed
EP-0755979-A2 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1997-01-29 EP claimed
EP-0618269-A1 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1994-10-05 EP claimed
US-5087552-A Photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1992-02-11 US claimed
US-4853127-A POLYETHERIMIDES; FILTRATION; Domnick Hunter Ilblry Limited (GB) 1989-08-01 US claimed
US-4720516-A Composite material with improved properties MITSUBISHI RAYON CO., LTD. (JP) 1988-01-19 US claimed
US-4600770-A Water soluble imide coating composition and method of making from lactam, dianhydride and diamine IMI-TECH CORPORATION, ELK GROVE, ILL. A CORP. OF 1986-07-15 US claimed
US-4550130-A POLYOLEFIN MODIFIED WITH UNSATURATED CARBOXYLIC ACID, AND AMINE, EPOXY, AND/OR ISOCYANATE WITH REINFORCEMENT MITSUBISHI RAYON CO., LTD. (JP) 1985-10-29 US claimed
US-4311785-A Method for the preparation of highly heat-resistant relief structures and the use thereof SIEMENS AKTIENGESELLSCHAFT (DE) 1982-01-19 US claimed