Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 7/20 | 0.55 |
| ▸ | HSD17B10 | Q99714 | 7/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.55 |
| ▸ | ALOX15 | P16050 | 6/20 | 0.55 |
| ▸ | RECQL | P46063 | 4/20 | 0.55 |
| ▸ | LMNA | P02545 | 4/20 | 0.55 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.55 |
| ▸ | CA2 | P00918 | 3/20 | 0.55 |
| ▸ | CA1 | P00915 | 2/20 | 0.55 |
| ▸ | CDK2 | P24941 | 2/20 | 0.55 |
| ▸ | EGFR | P00533 | 2/20 | 0.55 |
| ▸ | FYN | P06241 | 2/20 | 0.55 |
| ▸ | MMP9 | P14780 | 2/20 | 0.55 |
| ▸ | ADAMTS4 | O75173 | 1/20 | 0.55 |
| ▸ | MMP2 | P08253 | 1/20 | 0.55 |
| ▸ | MMP8 | P22894 | 1/20 | 0.55 |
| ▸ | CA6 | P23280 | 1/20 | 0.55 |
| ▸ | MMP12 | P39900 | 1/20 | 0.55 |
| ▸ | ADAMTS5 | Q9UNA0 | 1/20 | 0.55 |
| ▸ | DBH | P09172 | 2/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30394650 | 1.00 | HPGD (0.55) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| SCHEMBL337585 | 0.89 | ALDH1A1 (0.69) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| SCHEMBL29453072 | 0.89 | ALDH1A1 (0.69) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| SCHEMBL18948647 | 0.86 | HPGD (0.50) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| SCHEMBL29737462 | 0.86 | ALDH1A1 (0.44) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| SCHEMBL1883019 | 0.86 | ALDH1A1 (0.44) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| SCHEMBL9973588 | 0.83 | HPGD (0.61) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| SCHEMBL79393 | 0.81 | HPGD (0.58) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| Boric Acid SCHEMBL29771843 | 0.81 | HPGD (0.58) | HPGDHSD17B10ALDH1A1ALOX15RECQL | |
| SCHEMBL13992463 | 0.79 | HPGD (0.55) | HPGDHSD17B10ALDH1A1ALOX15RECQL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119998398-A | Aromatic polycarbonate resin composition and molded article thereof | 帝人株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119948103-A | Resin composition and molded article thereof | 帝人株式会社 | 2025-05-06 | — | — | CN | disclosed |
| CN-119923444-A | Thermoplastic resin composition and molded article comprising the same | 帝人株式会社 | 2025-05-02 | — | — | CN | disclosed |
| CN-119365538-A | Polycarbonate resin composition and molded article comprising the same | 帝人株式会社 | 2025-01-24 | — | — | CN | disclosed |
| EP-3730638-B1 | A SINTERED BODY | DAINIPPON INK & CHEMICALS (JP) | 2024-08-14 | — | — | EP | disclosed |
| CN-112689800-B | Photosensitive resin composition for forming permanent film, cured film, electronic device, and method for producing same | 住友电木株式会社 | 2024-07-30 | — | — | CN | disclosed |
| CN-117203255-A | Polyurethane and moisture curable composition comprising the same | H.B.富乐公司 | 2023-12-08 | — | — | CN | disclosed |
| CN-114072461-B | Thermoplastic resin composition, molded article and product | 三菱电机株式会社 | 2023-11-14 | — | — | CN | disclosed |
| CN-113383035-B | Molding material comprising carbon fiber-reinforced polycarbonate resin composition | 帝人株式会社 | 2023-08-01 | — | — | CN | disclosed |
| CN-113557270-B | Impeller and resin composition thereof | 帝人株式会社 | 2023-07-28 | — | — | CN | disclosed |
| WO-2014118163-A2 | AQUEOUS ADHESIVE COMPOSITION FOR THE BONDING OF WOOD | COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN (FR) | 2014-08-07 | — | — | WO | disclosed |
| WO-2014111440-A2 | AQUEOUS POLYALDEHYDE AND POLYPHENOL ADHESIVE COMPOSITION | COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN (FR) | 2014-07-24 | — | — | WO | disclosed |
| EP-1877865-A2 | NANOCOMPOSITE PHOTORESIST COMPOSITION FOR IMAGING THICK FILMS | AZ Electronic Materials USA Corp. (US) | 2008-01-16 | — | — | EP | disclosed |
| WO-2006109185-A2 | NANOCOMPOSITE PHOTORESIST COMPOSITION FOR IMAGING THICK FILMS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2006-10-19 | — | — | WO | disclosed |
| EP-1497368-A1 | NOVOLAK RESIN MIXTURES AND PHOTOSENSITIVE COMPOSITIONS COMPRISING THE SAME | Clariant International Ltd. (CH) | 2005-01-19 | — | — | EP | disclosed |
| WO-2003085045-A1 | NOVOLAK RESIN MIXTURES AND PHOTOSENSITIVE COMPOSITIONS COMPRISING THE SAME | CLARIANT INTERNATIONAL LTD (CH) | 2003-10-16 | — | — | WO | disclosed |
| EP-0530148-B1 | Positive photo resist with increased dissolving power and reduced crystallisation tendency as well as new tetra(hydroxyphenyl)alkane | OLIN MICROELECTRONIC CHEM INC (US) | 1998-12-23 | — | — | EP | disclosed |
| US-5554797-A | ENHANCE PHOTOSENSITIVITY AND/OR RATE OF DEVELOPMENT OF PHOTORESISTS | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-09-10 | — | — | US | disclosed |
| US-5296330-A | Resolution, amorphous | CIBA-GEIGY CORP. (US) | 1994-03-22 | — | — | US | disclosed |
| EP-0530148-A1 | Positive photo resist with increased dissolving power and reduced crystallisation tendency as well as new tetra(hydroxyphenyl)alkane | OCG Microelectronic Materials Inc. (US) | 1993-03-03 | — | — | EP | disclosed |