Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 2/20 | 0.48 |
| ▸ | KCNH2 | Q12809 | 6/20 | 0.45 |
| ▸ | TSHR | P16473 | 2/20 | 0.45 |
| ▸ | TP53 | P04637 | 1/20 | 0.45 |
| ▸ | PLA2G4B | P0C869 | 1/20 | 0.44 |
| ▸ | CA12 | O43570 | 1/20 | 0.43 |
| ▸ | CA1 | P00915 | 1/20 | 0.43 |
| ▸ | CA2 | P00918 | 1/20 | 0.43 |
| ▸ | CA7 | P43166 | 1/20 | 0.43 |
| ▸ | CA9 | Q16790 | 1/20 | 0.43 |
| ▸ | NPC1 | O15118 | 1/20 | 0.43 |
| ▸ | RAB9A | P51151 | 1/20 | 0.43 |
| ▸ | FAAH | O00519 | 5/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Trifluoromethanesulfonic Acid SCHEMBL4619536 | 1.00 | LTA4H (0.48) | LTA4HKCNH2TSHRTP53PLA2G4B | |
| Trifluoromethanesulfonic Acid SCHEMBL4618163 | 1.00 | LTA4H (0.48) | LTA4HKCNH2TSHRTP53PLA2G4B | |
| Trifluoromethanesulfonic Acid SCHEMBL4619730 | 0.95 | TSHR (0.48) | LTA4HKCNH2TSHRTP53PLA2G4B | |
| Trifluoromethanesulfonic Acid SCHEMBL4618765 | 0.95 | TSHR (0.48) | LTA4HKCNH2TSHRTP53PLA2G4B | |
| SCHEMBL3872702 | 0.89 | LTA4H (0.42) | LTA4HTSHRTP53PLA2G4BCA12 | |
| SCHEMBL2438060 | 0.88 | TSHR (0.47) | LTA4HTSHRTP53PLA2G4BCA12 | |
| SCHEMBL29745975 | 0.88 | TSHR (0.47) | LTA4HTSHRTP53PLA2G4BCA12 | |
| SCHEMBL2436260 | 0.86 | TSHR (0.44) | LTA4HTSHRTP53PLA2G4BCA12 | |
| SCHEMBL2437074 | 0.86 | TSHR (0.44) | LTA4HTSHRTP53PLA2G4BCA12 | |
| Trifluoromethanesulfonic Acid SCHEMBL4622358 | 0.86 | LTA4H (0.44) | LTA4HKCNH2TSHRTP53PLA2G4B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1943287-A2 | MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE | General Electric Company (US) | 2008-07-16 | — | — | EP | disclosed |
| US-7378455-B2 | A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device | GENERAL ELECTRIC COMPANY (US) | 2008-05-27 | — | — | US | disclosed |
| WO-2007005280-A2 | MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE | GENERAL ELECTRIC COMPANY (US) | 2007-01-11 | — | — | WO | disclosed |
| US-20070004819-A1 | A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device | CITIBANK, N.A., AS COLLATERAL AGENT | 2007-01-04 | — | — | US | disclosed |