SCHEMBL4612199

SCHEMBL4612199

C=CC(=O)Sc1ccc(-c2ccccc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKT1 P31749 1/20 0.41
TP53 P04637 1/20 0.40
MAPT P10636 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
HNF4A P41235 2/20 0.39
ACMSD Q8TDX5 2/20 0.39
DHFR P00374 1/20 0.39
MCL1 Q07820 1/20 0.39
CDC25B P30305 1/20 0.39
ATM Q13315 1/20 0.39
ABCC4 O15439 1/20 0.38
LMNA P02545 1/20 0.38
GAA P10253 1/20 0.38
TSHR P16473 1/20 0.38
PTGS1 P23219 1/20 0.38
HTT P42858 1/20 0.38
EGFR P00533 2/20 0.38
RAB9A P51151 2/20 0.38
ALDH1A1 P00352 1/20 0.38
HPGD P15428 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16170352 0.92 AKT1 (0.32) AKT1MAPT
SCHEMBL16170477 0.92 AKT1 (0.32) AKT1MAPT
SCHEMBL16170754 0.92 AKT1 (0.32) AKT1MAPT
SCHEMBL330818 0.88 AKT1 (0.46) AKT1TP53MAPTSMN1; SMN2LMNA
SCHEMBL4857114 0.85 AKT1 (0.36) AKT1MAPTLMNATSHRHTT
SCHEMBL16170601 0.84 HDAC8 (0.34) AKT1ACMSDMCL1TGM2CYP2C9
SCHEMBL16170751 0.83 HDAC2 (0.36) MAPTLMNAGAARAB9AALDH1A1
SCHEMBL16170650 0.81 ACACB (0.33) SMN1; SMN2HNF4ARAB9AALDH1A1HPGD
SCHEMBL16170711 0.81 ESR1 (0.38) TP53MAPTSMN1; SMN2ACMSDEGFR
SCHEMBL31543789 0.81 AKT1 (0.38) AKT1TP53MAPTSMN1; SMN2HNF4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7462653-B2 Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof TAIYO INK MANUFACTURING CO., LTD. (JP) 2008-12-09 US disclosed
EP-1624001-B1 PHOTOCURING/THERMOSETTING INKJET COMPOSITION AND PRINTED WIRING BOARD USING SAME TAIYO INK MFG CO LTD (JP) 2008-04-16 EP disclosed
US-20060058412-A1 Monomer having a (meth)acryloyl group and thermosetting functional group; a photoreactive diluent having a weight-average molecular weight of not more than 700; photopolymerization initiator; viscosity of not more than 150 mPa*s at 25 degrees C.; solder resist pattern directly drawn on printed circuit TAIYO INK MFG. CO., LTD. (JP) 2006-03-16 US disclosed
EP-1624001-A1 PHOTOCURING/THERMOSETTING INKJET COMPOSITION AND PRINTED WIRING BOARD USING SAME Taiyo Ink Manufacturing Co. Ltd (JP) 2006-02-08 EP disclosed