⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13610 | 0.97 | — | — | |
| Fluoride SCHEMBL3409367 | 0.94 | — | — | |
| Phosphine SCHEMBL3070415 | 0.94 | — | — | |
| SCHEMBL9751147 | 0.94 | — | — | |
| SCHEMBL2868065 | 0.94 | — | — | |
| SCHEMBL29952 | 0.94 | — | — | |
| SCHEMBL6703749 | 0.94 | — | — | |
| Formaldehyde SCHEMBL5303037 | 0.94 | — | — | |
| SCHEMBL2547723 | 0.94 | — | — | |
| Sulfuric Acid SCHEMBL1509755 | 0.94 | CA5A (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 56 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10793795-B1 | Nanocarbon particle based fuel additive | Adámas Nanotechnologies, Inc. (US) | 2020-10-06 | — | — | US | claimed |
| EP-1786951-B1 | SELECTIVE NICKEL PLATING OF ALUMINIUM, COPPER AND TUNGSTEN STRUCTURES | MICRON TECHNOLOGY INC (US) | 2019-11-06 | — | — | EP | claimed |
| EP-3030688-B1 | ELECTROLESS NICKEL PLATING SOLUTION AND METHOD | MACDERMID ACUMEN INC (US) | 2019-10-30 | — | — | EP | claimed |
| US-9708693-B2 | High phosphorus electroless nickel | CITIBANK, N.A. | 2017-07-18 | — | — | US | claimed |
| EP-3152345-A1 | HIGH PHOSPHORUS ELECTROLESS NICKEL | MacDermid Acumen, Inc. (US) | 2017-04-12 | — | — | EP | claimed |
| EP-3030688-A1 | ELECTROLESS NICKEL PLATING SOLUTION AND METHOD | MacDermid Acumen, Inc. (US) | 2016-06-15 | — | — | EP | claimed |
| US-20150345026-A1 | High Phosphorus Electroless Nickel | MACDERMID ACUMEN, INC. (US) | 2015-12-03 | — | — | US | claimed |
| US-20150044374-A1 | Electroless Nickel Plating Solution and Method | MACDERMID ACUMEN, INC. (US) | 2015-02-12 | — | — | US | claimed |
| WO-2015020772-A1 | ELECTROLESS NICKEL PLATING SOLUTION AND METHOD | MACDERMID ACUMEN INC. (US) | 2015-02-12 | — | — | WO | claimed |
| EP-2783399-A2 | METHOD FOR TREATING METAL SURFACES | MacDermid Acumen, Inc. (US) | 2014-10-01 | — | — | EP | claimed |
| WO-2013078077-A2 | METHOD FOR TREATING METAL SURFACES | MACDERMID ACUMEN, INC. (US) | 2013-05-30 | — | — | WO | claimed |
| US-20120061710-A1 | Method for Treating Metal Surfaces | MACDERMID ACUMEN, INC. | 2012-03-15 | — | — | US | claimed |
| US-20120061698-A1 | Method for Treating Metal Surfaces | MACDERMID ACUMEN, INC. | 2012-03-15 | — | — | US | claimed |
| US-7855454-B2 | Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures | MICRON TECHNOLOGY, INC. (US) | 2010-12-21 | — | — | US | claimed |
| US-7279407-B2 | Selective nickel plating of aluminum, copper, and tungsten structures | MICRON TECHNOLOGY, INC. (US) | 2007-10-09 | — | — | US | claimed |
| US-20070132105-A1 | Selective activation of aluminum, copper, and tungsten structures | MICRON TECHNOLOGY, INC. | 2007-06-14 | — | — | US | claimed |
| EP-1786951-A2 | SELECTIVE NICKEL PLATING OF ALUMINIUM, COPPER AND TUNGSTEN STRUCTURES | MICRON TECHNOLOGY, INC. (US) | 2007-05-23 | — | — | EP | claimed |
| WO-2006028715-A2 | SELECTIVE NICKEL PLATING OF ALUMINIUM, COPPER AND TUNGSTEN STRUCTURES | MICRON TECHNOLOGY, INC. (US) | 2006-03-16 | — | — | WO | claimed |
| US-20060046088-A1 | Selective nickel plating of aluminum, copper, and tungsten structures | MICRON TECHNOLOGY, INC. | 2006-03-02 | — | — | US | claimed |
| EP-2783399-B1 | METHOD FOR TREATING METAL SURFACES | MACDERMID ACUMEN INC (US) | 2021-12-29 | — | — | EP | disclosed |
| US-10793795-B1 | Nanocarbon particle based fuel additive | Adámas Nanotechnologies, Inc. (US) | 2020-10-06 | — | — | US | disclosed |
| EP-1786951-B1 | SELECTIVE NICKEL PLATING OF ALUMINIUM, COPPER AND TUNGSTEN STRUCTURES | MICRON TECHNOLOGY INC (US) | 2019-11-06 | — | — | EP | disclosed |
| EP-3030688-B1 | ELECTROLESS NICKEL PLATING SOLUTION AND METHOD | MACDERMID ACUMEN INC (US) | 2019-10-30 | — | — | EP | disclosed |
| US-10446440-B2 | Semiconductor devices comprising nickel— and copper—containing interconnects | MICRON TECHNOLOGY, INC. (US) | 2019-10-15 | — | — | US | disclosed |
| US-10246778-B2 | Electroless nickel plating solution and method | MACDERMID ACUMEN, INC. (US) | 2019-04-02 | — | — | US | disclosed |
| US-20180358263-A1 | SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTERCONNECTS | MICRON TECHNOLOGY, INC. | 2018-12-13 | — | — | US | disclosed |
| US-10062608-B2 | Semiconductor devices comprising nickel- and copper-containing interconnects | MICRON TECHNOLOGY, INC. (US) | 2018-08-28 | — | — | US | disclosed |
| US-20170283954-A1 | METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES | MICRON TECHNOLOGY, INC. | 2017-10-05 | — | — | US | disclosed |
| US-9708693-B2 | High phosphorus electroless nickel | CITIBANK, N.A. | 2017-07-18 | — | — | US | disclosed |
| US-9640433-B2 | Methods of forming interconnects and semiconductor structures | MICRON TECHNOLOGY, INC. (US) | 2017-05-02 | — | — | US | disclosed |
| EP-3152345-A1 | HIGH PHOSPHORUS ELECTROLESS NICKEL | MacDermid Acumen, Inc. (US) | 2017-04-12 | — | — | EP | disclosed |
| EP-3030688-A1 | ELECTROLESS NICKEL PLATING SOLUTION AND METHOD | MacDermid Acumen, Inc. (US) | 2016-06-15 | — | — | EP | disclosed |
| US-20150345026-A1 | High Phosphorus Electroless Nickel | MACDERMID ACUMEN, INC. (US) | 2015-12-03 | — | — | US | disclosed |
| US-20150044374-A1 | Electroless Nickel Plating Solution and Method | MACDERMID ACUMEN, INC. (US) | 2015-02-12 | — | — | US | disclosed |
| WO-2015020772-A1 | ELECTROLESS NICKEL PLATING SOLUTION AND METHOD | MACDERMID ACUMEN INC. (US) | 2015-02-12 | — | — | WO | disclosed |
| EP-2783399-A2 | METHOD FOR TREATING METAL SURFACES | MacDermid Acumen, Inc. (US) | 2014-10-01 | — | — | EP | disclosed |
| US-20140154879-A1 | METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES | MICRON TECHNOLOGY, INC. (US) | 2014-06-05 | — | — | US | disclosed |
| US-8647982-B2 | Methods of forming interconnects in a semiconductor structure | MICRON TECHNOLOGY, INC. (US) | 2014-02-11 | — | — | US | disclosed |
| EP-2613892-A1 | METHOD FOR TREATING METAL SURFACES | MacDermid Acumen, Inc. (US) | 2013-07-17 | — | — | EP | disclosed |
| WO-2013078077-A2 | METHOD FOR TREATING METAL SURFACES | MACDERMID ACUMEN, INC. (US) | 2013-05-30 | — | — | WO | disclosed |
| US-20120061710-A1 | Method for Treating Metal Surfaces | MACDERMID ACUMEN, INC. | 2012-03-15 | — | — | US | disclosed |
| US-20120061705-A1 | Method for Treating Metal Surfaces | MACDERMID ACUMEN, INC. | 2012-03-15 | — | — | US | disclosed |
| US-20120061698-A1 | Method for Treating Metal Surfaces | MACDERMID ACUMEN, INC. | 2012-03-15 | — | — | US | disclosed |
| WO-2012033568-A1 | METHOD FOR TREATING METAL SURFACES | MACDERMID ACUMEN, INC. (US) | 2012-03-15 | — | — | WO | disclosed |
| US-7855454-B2 | Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures | MICRON TECHNOLOGY, INC. (US) | 2010-12-21 | — | — | US | disclosed |
| US-20090176362-A1 | METHODS OF FORMING INTERCONNECTS IN A SEMICONDUCTOR STRUCTURE | MICRON TECHNOLOGY, INC. (US) | 2009-07-09 | — | — | US | disclosed |
| US-7279407-B2 | Selective nickel plating of aluminum, copper, and tungsten structures | MICRON TECHNOLOGY, INC. (US) | 2007-10-09 | — | — | US | disclosed |
| US-20070132105-A1 | Selective activation of aluminum, copper, and tungsten structures | MICRON TECHNOLOGY, INC. | 2007-06-14 | — | — | US | disclosed |
| EP-1786951-A2 | SELECTIVE NICKEL PLATING OF ALUMINIUM, COPPER AND TUNGSTEN STRUCTURES | MICRON TECHNOLOGY, INC. (US) | 2007-05-23 | — | — | EP | disclosed |
| EP-1378584-B1 | Electroless nickel plating solutions | ATOTECH DEUTSCHLAND GMBH (DE) | 2007-03-07 | — | — | EP | disclosed |
| US-20070004200-A1 | Selective activation of aluminum, copper, and tungsten structures | AKRAM SALMAN | 2007-01-04 | — | — | US | disclosed |
| WO-2006028715-A2 | SELECTIVE NICKEL PLATING OF ALUMINIUM, COPPER AND TUNGSTEN STRUCTURES | MICRON TECHNOLOGY, INC. (US) | 2006-03-16 | — | — | WO | disclosed |
| US-20060046088-A1 | Selective nickel plating of aluminum, copper, and tungsten structures | MICRON TECHNOLOGY, INC. | 2006-03-02 | — | — | US | disclosed |
| US-6800121-B2 | MIXTURES OF NICKEL SALTS OF ALKYLSULFONIC ACID AND REDUCING AGENTS SUCH AS HYPOPHOSPHOROUS ACID, USED FOR COATING ALLOY SUBSTRATES | ATOTECH DEUTSCHLAND GMBH (DE) | 2004-10-05 | — | — | US | disclosed |
| EP-1378584-A1 | Electroless nickel plating solutions | ATOTECH DEUTSCHLAND GMBH (DE) | 2004-01-07 | — | — | EP | disclosed |
| US-20030232148-A1 | Electroless nickel plating solutions | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2003-12-18 | — | — | US | disclosed |
| US-20030232148-A1 | Electroless nickel plating solutions | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2003-12-18 | — | — | US | disclosed |