SCHEMBL4619585

SCHEMBL4619585

C=CCc1ccccc1[SiH2]OCc1ccccc1[N+](=O)[O-]

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.43
HTT P42858 2/20 0.43
TSHR P16473 1/20 0.42
MAOB P27338 1/20 0.40
HPGD P15428 1/20 0.39
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36
KMT2A Q03164 1/20 0.36
CA12 O43570 1/20 0.36
CA9 Q16790 1/20 0.36
RECQL P46063 1/20 0.35
HTR1A P08908 1/20 0.34
ADRA1D P25100 1/20 0.34
ADRA1A P35348 1/20 0.34
ADRA1B P35368 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
KDM4E B2RXH2 1/20 0.34
CCR5 P51681 1/20 0.34
ACHE P22303 1/20 0.33
GABRA1 P14867 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4619695 0.86 ALDH1A1 (0.34) ALDH1A1HTTTSHRHPGDNPC1
SCHEMBL11057498 0.82 ALDH1A1 (0.50) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL30367918 0.80 ALDH1A1 (0.58) ALDH1A1HTTTSHRHPGDNPC1
SCHEMBL1135905 0.80 ALDH1A1 (0.58) ALDH1A1HTTTSHRHPGDNPC1
SCHEMBL10863915 0.80 HSD17B10 (0.49) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL4620030 0.79 ALDH1A1 (0.43) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL6335740 0.78 ALDH1A1 (0.38) ALDH1A1HTTHPGDKMT2ARECQL
Bromide SCHEMBL28506426 0.78 ALDH1A1 (0.56) ALDH1A1HTTTSHRHPGDNPC1
SCHEMBL11113892 0.76 ALDH1A1 (0.43) ALDH1A1HTTTSHRMAOBHPGD
SCHEMBL4619017 0.76 TSHR (0.50) ALDH1A1HTTTSHRMAOBHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-6096836-A OXYGEN CONTAINING AROMATIC CATALYST AND ALUMINUM COMPOUND KABUSHIKI KAISHA TOSHIBA (JP) 2000-08-01 US disclosed
US-5811497-A STORAGE STABLE EPOXY RESINS ACTIVATE THE CURING WHEN APPLYING THE HEAT; FLEXIBILITY, DIELECTRIC, MECHANICAL STRENGTH KABUSHIKI KAISHA TOSHIBA (JP) 1998-09-22 US disclosed
EP-0195846-B1 PHOTO-CURABLE EPOXY RESIN TYPE COMPOSITION AND CURING PROCESS KABUSHIKI KAISHA TOSHIBA (JP) 1991-07-31 EP disclosed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US disclosed
EP-0139234-B1 RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1989-11-29 EP disclosed
US-4831063-A RAPID CURING OF AN UNSATURATED EPOXY/ORGANOALUMINUM COMPOUND MIXTURE BY ADDING A SILYLPEROXY COMPOUND; PAINTS; COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1989-05-16 US disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0135887-B1 PHOTOCURABLE COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-04-06 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed
US-4599155-A POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1986-07-08 US disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed
EP-0135887-A2 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-03 EP disclosed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP disclosed