SCHEMBL4619722

SCHEMBL4619722

Cc1cccc(CO[Si](C)(C)C)c1[N+](=O)[O-]

nearest known ligand 0.55

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.55
TDP1 Q9NUW8 1/20 0.55
TSHR P16473 3/20 0.49
HPGD P15428 3/20 0.44
POLB P06746 2/20 0.44
KAT2B Q92831 1/20 0.40
BMP1 P13497 2/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
TP53 P04637 1/20 0.37
MEN1 O00255 3/20 0.37
KMT2A Q03164 3/20 0.37
MAPT P10636 1/20 0.37
MAPK1 P28482 1/20 0.37
CA12 O43570 1/20 0.37
CA9 Q16790 1/20 0.37
HSD17B10 Q99714 1/20 0.37
NPC1 O15118 1/20 0.37
RAB9A P51151 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26076857 0.82 ALDH1A1 (0.49) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL11133058 0.82 ALDH1A1 (0.49) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL31615049 0.82 ALDH1A1 (0.49) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL6655757 0.82 ALDH1A1 (0.60) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL28536170 0.81 ALDH1A1 (0.58) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL6653894 0.79 ALDH1A1 (0.56) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL10426764 0.79 ALDH1A1 (0.45) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL6655188 0.78 ALDH1A1 (0.55) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL3117929 0.78 ALDH1A1 (0.55) ALDH1A1TDP1TSHRHPGDPOLB
SCHEMBL13344110 0.78 TDP1 (0.69) ALDH1A1TDP1TSHRHPGDPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773208-B2 Cationically curable composition and cured product production method DEXERIALS CORPORATION (JP) 2023-10-03 US disclosed
US-20210214489-A1 CATIONICALLY CURABLE COMPOSITION AND CURED PRODUCT PRODUCTION METHOD DEXERIALS CORPORATION (JP) 2021-07-15 US disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
EP-1462496-A2 Coating composition and method for application thereof KANSAI PAINT CO., LTD. (JP) 2004-09-29 EP disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-6319557-B1 FORMING MULTILAYER OVERCOATING, COLORING, THERMOSETTING RESIN FILMS, EPOXY ACRYLIC RESINS AND CATALYST KANSAI PAINT CO., LTD. (JP) 2001-11-20 US disclosed
US-4831063-A RAPID CURING OF AN UNSATURATED EPOXY/ORGANOALUMINUM COMPOUND MIXTURE BY ADDING A SILYLPEROXY COMPOUND; PAINTS; COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1989-05-16 US disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0282634-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1988-09-21 EP disclosed
EP-0135887-B1 PHOTOCURABLE COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-04-06 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed
US-4599155-A POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1986-07-08 US disclosed
EP-0172330-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1986-02-26 EP disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed
EP-0135887-A2 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-03 EP disclosed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP disclosed