SCHEMBL4619992

SCHEMBL4619992

CC=CC[Si](O)(c1ccccc1)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.38
ESR1 P03372 1/20 0.33
ESR2 Q92731 1/20 0.33
NR1H2 P55055 1/20 0.31
NR1H3 Q13133 1/20 0.31
MAOB P27338 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8027385 1.00 MAPT (0.38) MAPTESR1ESR2NR1H2NR1H3
SCHEMBL9246667 0.82 MAPT (0.33) MAPTESR1ESR2NR1H2NR1H3
SCHEMBL9246663 0.82 MAPT (0.33) MAPTESR1ESR2NR1H2NR1H3
SCHEMBL1566054 0.74 ALDH1A1 (0.34) MAPTESR1ESR2NR1H2NR1H3
SCHEMBL4618369 0.72 MAPT (0.33) MAPT
SCHEMBL4618367 0.72 MAPT (0.33) MAPT
SCHEMBL21115933 0.71 MAPT (0.32) MAPT
SCHEMBL272316 0.70 ESR1 (0.39) MAPTESR1ESR2NR1H2NR1H3
SCHEMBL18610644 0.67 MAPT (0.37) MAPTESR1ESR2NR1H2NR1H3
SCHEMBL271913 0.67 ESR1 (0.37) MAPTESR1ESR2NR1H2NR1H3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-6096836-A OXYGEN CONTAINING AROMATIC CATALYST AND ALUMINUM COMPOUND KABUSHIKI KAISHA TOSHIBA (JP) 2000-08-01 US disclosed
US-5811497-A STORAGE STABLE EPOXY RESINS ACTIVATE THE CURING WHEN APPLYING THE HEAT; FLEXIBILITY, DIELECTRIC, MECHANICAL STRENGTH KABUSHIKI KAISHA TOSHIBA (JP) 1998-09-22 US disclosed
US-5439746-A Formed by coating or impregnating a reinforcement sheet and curing; mechanical strength; corrosion and heat resistance; electrical properties KABUSHIKI KAISHA TOSHIBA (JP) 1995-08-08 US disclosed