SCHEMBL4620045

SCHEMBL4620045

CCCCCCCCCCCCCCCCC(C(C)=O)C(=O)[O-].CCCCCCCCCCCCCCCCC(C(C)=O)C(=O)[O-].CCCCCCCCCCCCCCCCC(C(C)=O)C(=O)[O-].[Al+3]

nearest known ligand 0.55

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CA2 P00918 2/20 0.55
CA1 P00915 2/20 0.53
GPR84 Q9NQS5 7/20 0.46
FFAR1 O14842 1/20 0.44
NFKB1 P19838 1/20 0.43
MAPT P10636 1/20 0.42
LCK P06239 1/20 0.42
PPARD Q03181 1/20 0.42
ZDHHC20 Q5W0Z9 1/20 0.42
ZDHHC2 Q9UIJ5 1/20 0.42
CES2 O00748 3/20 0.41
CES1 P23141 3/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4617592 1.00 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
SCHEMBL4336153 1.00 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
SCHEMBL4620547 1.00 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
SCHEMBL4617888 1.00 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
SCHEMBL5969168 1.00 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
SCHEMBL23581912 1.00 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
SCHEMBL8167693 0.96 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
SCHEMBL9851869 0.96 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
Potassium Ion SCHEMBL7179602 0.96 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1
SCHEMBL7519425 0.96 CA2 (0.55) CA2CA1GPR84FFAR1NFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US claimed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US claimed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed