SCHEMBL4624700

SCHEMBL4624700

CO[Si](CCCNCCC[Si](OC)(OC)OC)(OC)OC.[SiH4]

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.38
CHRM2 P08172 14/20 0.34
BCHE P06276 5/20 0.34
ACHE P22303 5/20 0.34
CHRM4 P08173 5/20 0.34
CHRM5 P08912 5/20 0.34
CHRM1 P11229 5/20 0.34
CHRM3 P20309 5/20 0.34
GRIN1 Q05586 4/20 0.34
GRIN2A Q12879 4/20 0.34
TSHR P16473 2/20 0.34
RECQL P46063 2/20 0.34
TP53 P04637 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2D6 P10635 1/20 0.34
THPO P40225 1/20 0.34
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
ALDH1A1 P00352 1/20 0.33
GLA P06280 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49693 0.97 LMNA (0.39) LMNACHRM2BCHEACHECHRM4
SCHEMBL29534835 0.95 LMNA (0.38) LMNACHRM2BCHEACHECHRM4
SCHEMBL1931026 0.95 LMNA (0.38) LMNACHRM2BCHEACHECHRM4
Ammonia Solution, Strong SCHEMBL5681835 0.95 LMNA (0.38) LMNACHRM2BCHEACHECHRM4
SCHEMBL48137 0.95 LMNA (0.38) LMNACHRM2BCHEACHECHRM4
SCHEMBL5858297 0.92 LMNA (0.41) LMNACHRM2BCHEACHECHRM4
SCHEMBL1411794 0.91 LMNA (0.46) LMNAACHEGRIN1GRIN2ATSHR
SCHEMBL8669640 0.91 CA12 (0.46) LMNACHRM2TSHRRECQLTP53
SCHEMBL14454275 0.90 LMNA (0.35) LMNACHRM2TSHRMEN1KMT2A
SCHEMBL20210417 0.90 LMNA (0.39) LMNACHRM2BCHEACHECHRM4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3057913-A1 METHODS AND APPARATUS PROVIDING A SUBSTRATE AND PROTECTIVE COATING THEREON Corning Incorporated (US) 2016-08-24 EP claimed
WO-2015057799-A1 METHODS AND APPARATUS PROVIDING A SUBSTRATE AND PROTECTIVE COATING THEREON CORNING INCORPORATED (US) 2015-04-23 WO claimed
US-20150110990-A1 Methods and Apparatus Providing A Substrate and Protective Coating Thereon CORNING INCORPORATED 2015-04-23 US claimed
US-10808168-B2 Methods for controlling conductive aggregates HALLIBURTON ENERGY SERVICES, INC. (US) 2020-10-20 US disclosed
EP-3684872-A1 COMPOSITIONS BASED ON SILANE-TERMINATED POLYMERS WITH IMPROVED ADHESION ON THERMOPLASTICS Sika Technology AG (CH) 2020-07-29 EP disclosed
US-20200048541-A1 METHODS FOR CONTROLLING CONDUCTIVE AGGREGATES HALLIBURTON ENERGY SERVICES, INC. 2020-02-13 US disclosed
WO-2019057670-A1 COMPOSITIONS BASED ON SILANE-TERMINATED POLYMERS WITH IMPROVED ADHESION ON THERMOPLASTICS SIKA TECHNOLOGY AG (CH) 2019-03-28 WO disclosed
US-10066166-B2 Composition for alignment layer, array substrate for display device comprising the same SAMSUNG DISPLAY CO., LTD. (KR) 2018-09-04 US disclosed
WO-2018136064-A1 METHODS FOR CONTROLLING CONDUCTIVE AGGREGATES HALLIBURTON ENERGY SERVICES, INC. (US) 2018-07-26 WO disclosed
US-20170066968-A1 COMPOSITION FOR ALIGMENT LAYER, ARRAY SUBSTRATE FOR DISPLAY DEVICE COMPRISING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2017-03-09 US disclosed
EP-3057913-A1 METHODS AND APPARATUS PROVIDING A SUBSTRATE AND PROTECTIVE COATING THEREON Corning Incorporated (US) 2016-08-24 EP disclosed
EP-1694795-B2 SYSTEM FOR BONDING GLASS INTO A STRUCTURE DOW GLOBAL TECHNOLOGIES LLC (US) 2016-03-30 EP disclosed
US-20150110990-A1 Methods and Apparatus Providing A Substrate and Protective Coating Thereon CORNING INCORPORATED 2015-04-23 US disclosed
WO-2015057799-A1 METHODS AND APPARATUS PROVIDING A SUBSTRATE AND PROTECTIVE COATING THEREON CORNING INCORPORATED (US) 2015-04-23 WO disclosed
US-7416599-B2 System for bonding glass into a structure DOW GLOBAL TECHNOLOGIES INC. (US) 2008-08-26 US disclosed
EP-1694795-B1 SYSTEM FOR BONDING GLASS INTO A STRUCTURE DOW GLOBAL TECHNOLOGIES INC (US) 2008-07-23 EP disclosed
EP-1694795-A1 SYSTEM FOR BONDING GLASS INTO A STRUCTURE The Dow Global Technologies Inc. (US) 2006-08-30 EP disclosed
WO-2005059056-A1 SYSTEM FOR BONDING GLASS INTO A STRUCTURE DOW GLOBAL TECHNOLOGIES INC. (US) 2005-06-30 WO disclosed
US-20050126683-A1 System for bonding glass into a structure DOW GLOBAL TECHNOLOGIES LLC 2005-06-16 US disclosed
US-20030005646-A1 Surface modification of coated abrasives to enhance their adhesion in resin bond tools DIAMOND INNOVATIONS, INC. 2003-01-09 US disclosed