⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28104483 | 0.98 | ALPG (0.44) | — | |
| Hydrochloric Acid SCHEMBL20262982 | 0.98 | ALPG (0.46) | — | |
| Bromide SCHEMBL28236460 | 0.98 | ALPG (0.44) | — | |
| SCHEMBL23044741 | 0.92 | ALPG (0.41) | — | |
| SCHEMBL22497071 | 0.90 | TLR8 (0.41) | — | |
| SCHEMBL3471367 | 0.88 | ALPG (0.42) | — | |
| SCHEMBL28016960 | 0.88 | ALPG (0.42) | — | |
| SCHEMBL23044738 | 0.88 | ALPG (0.44) | — | |
| Formamide SCHEMBL8546522 | 0.88 | ALDH1A1 (0.44) | — | |
| Acetic Acid SCHEMBL28296570 | 0.88 | ALPG (0.49) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 549 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12637541-B2 | Alkylene oxide polymerization using aluminum compounds and cyclic amidines | DOW GLOBAL TECHNOLOGIES LLC (US) | 2026-05-26 | — | — | US | claimed |
| US-12460303-B2 | Etching agent and method for producing circuit board | MEC COMPANY LTD (JP) | 2025-11-04 | — | — | US | claimed |
| US-20250196021-A1 | METHODS OF SOLVENT DISPLACEMENT FOR METAL-CONTAINING IONIC LIQUIDS | CHEVRON PHILLIPS CHEMICAL COMPANY LP | 2025-06-19 | — | — | US | claimed |
| WO-2025128828-A1 | METHODS OF SOLVENT DISPLACEMENT FOR METAL-CONTAINING IONIC LIQUIDS | CHEVRON PHILLIPS CHEMICAL COMPANY LP (US) | 2025-06-19 | — | — | WO | claimed |
| CN-119390937-A | Isocyanate curing agent, conductive silver paste and preparation method | 西安稀有金属材料研究院有限公司 | 2025-02-07 | — | — | CN | claimed |
| EP-4097168-B1 | ALKYLENE OXIDE POLYMERIZATION USING ALUMINUM COMPOUNDS AND CYCLIC AMIDINES | DOW GLOBAL TECHNOLOGIES LLC (US) | 2023-10-25 | — | — | EP | claimed |
| US-20230095201-A1 | ALKYLENE OXIDE POLYMERIZATION USING ALUMINUM COMPOUNDS AND CYCLIC AMIDINES | DOW GLOBAL TECHNOLOGIES LLC | 2023-03-30 | — | — | US | claimed |
| EP-4097168-A1 | ALKYLENE OXIDE POLYMERIZATION USING ALUMINUM COMPOUNDS AND CYCLIC AMIDINES | Dow Global Technologies LLC (US) | 2022-12-07 | — | — | EP | claimed |
| CN-115124727-A | Preparation method of MOF film | 中国科学院山西煤炭化学研究所 | 2022-09-30 | — | — | CN | claimed |
| EP-4063005-A1 | SUPERHYDROPHOBIC MEMBRANE AND PREPARATION METHOD THEREFOR, AND METHOD FOR CONCENTRATING AND RECYCLING MDI WASTE BRINE | Wanhua Chemical Group Co., Ltd. (CN) | 2022-09-28 | — | — | EP | claimed |
| US-20070293684-A1 | Method of preparing imidazolium surfactants | BRIDGESTONE CORPORATION | 2007-12-20 | — | — | US | claimed |
| US-7067930-B2 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-06-27 | — | — | US | claimed |
| US-6780674-B2 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-24 | — | — | US | claimed |
| US-20030155664-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-21 | — | — | US | claimed |
| US-6558812-B2 | Adherent to the surface of silicon flip chips, especially polyimide resins and nitride films; shock resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-06 | — | — | US | claimed |
| US-6479167-B2 | LIQUID EPOXY RESIN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-11-12 | — | — | US | claimed |
| US-20020089071-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-11 | — | — | US | claimed |
| US-20020077421-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-06-20 | — | — | US | claimed |
| US-20020045709-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-18 | — | — | US | claimed |
| US-20010034382-A1 | Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-25 | — | — | US | claimed |