SCHEMBL466305

SCHEMBL466305

O=C(C1(O)C=CC=CC1)C1(O)C=CC=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL809925 0.83
SCHEMBL18599190 0.83
SCHEMBL10531455 0.81
SCHEMBL2733070 0.81
SCHEMBL29234848 0.78
SCHEMBL8734917 0.76
SCHEMBL29130089 0.76
SCHEMBL6106227 0.76 NPSR1 (0.31)
SCHEMBL11453538 0.73
SCHEMBL28879729 0.73 CES2 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1043 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4404866-A1 3D PRINTING RESIN WITH SEPARATION EFFECT PRO3DURE MEDICAL GMBH (DE) 2024-07-31 EP claimed
WO-2023046869-A1 3D PRINTING RESIN WITH SEPARATION EFFECT Pro3dure Medical GmbH (DE) 2023-03-30 WO claimed
EP-4154842-A1 3D PRINTING RESIN WITH SEPARATION EFFECT PRO3DURE MEDICAL GMBH (DE) 2023-03-29 EP claimed
CN-112321984-B Silicon-modified 3D printing photocuring resin, 3D printing product and application thereof 广东省瑞晟新材料科技有限公司 2023-03-10 CN claimed
CN-111592620-B Photocuring material for 3D printing 广东省瑞晟新材料科技有限公司 2022-11-15 CN claimed
CN-111491776-B Hybrid photopolymer compositions for additive manufacturing 佩什托普公司 2022-06-03 CN claimed
US-20220056281-A1 APPLICATION OF ANTIMICROBIAL COATINGS USING ATMOSPHERIC PRESSURE PLASMA SPRAY SYSTEMS TRITON SYSTEMS, INC. 2022-02-24 US claimed
EP-3266815-B1 STABILIZED MATRIX-FILLED LIQUID RADIATION CURABLE RESIN COMPOSITIONS FOR ADDITIVE FABRICATION COVESTRO NETHERLANDS BV (NL) 2021-11-03 EP claimed
US-10919909-B2 Photoinitiated reactions LINTFIELD LIMITED (GB) 2021-02-16 US claimed
WO-2020191690-A1 PHOTO-CURABLE COMPOSITIONS FOR ADDITIVE MANUFACTURING HENKEL AG & CO. KGAA (DE) 2020-10-01 WO claimed
WO-2000003300-A1 STEREOLITHOGRAPHIC COMPOSITION FOR PREPARING POLYETHYLENE-LIKE ARTICLES DSM N.V. (NL) 2000-01-20 WO claimed
US-6011077-A DERIVATIVE OF A POLYVINYL ALCOHOL COMPRISING UNITS CONTAINING CROSSLINKABLE OLEFINICALLY UNSATURATED GROUPS, AND UNITS CONTAINING A BONDED PHOTOINITATOR NOVARTIS AG (CH) 2000-01-04 US claimed
EP-0506616-B1 Photosensitive acrylate mixture CIBA GEIGY AG (CH) 1998-01-21 EP claimed
EP-0605361-B1 Photosensitive compositions CIBA GEIGY AG (CH) 1997-04-02 EP claimed
US-5487966-A Photosensitive compositions CIBA-GEIGY CORPORATION (US) 1996-01-30 US claimed
EP-0517657-B1 Photosensitive compositions CIBA GEIGY AG (CH) 1995-12-27 EP claimed
US-5476749-A Blend of acrylated polyurethane, unsaturated compound and photoinitiator CIBA-GEIGY CORPORATION (US) 1995-12-19 US claimed
US-5476748-A Containing liquid epoxy resin, acrylated ester, photointiator and hydroxyl terminated polyethers, polyesters, or polyurethanes CIBA-GEIGY CORPORATION (US) 1995-12-19 US claimed
EP-0378144-B1 Photocurable compositions CIBA GEIGY AG (CH) 1995-03-08 EP claimed
EP-0378144-A2 Photocurable compositions CIBA-GEIGY AG (CH) 1990-07-18 EP claimed