SCHEMBL467558

SCHEMBL467558

CCCCCCCCCCCc1nc(CCC#N)c[nH]1

nearest known ligand 0.38

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
PKM P14618 1/20 0.38
HPGD P15428 1/20 0.38
KCNH2 Q12809 1/20 0.38
MAPK1 P28482 1/20 0.36
GPR84 Q9NQS5 4/20 0.36
TSHR P16473 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1985579 0.87 CTSK (0.31) ALDH1A1MAPK1TSHR
SCHEMBL10697416 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84
SCHEMBL27696702 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84
SCHEMBL28300118 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84
SCHEMBL9133514 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84
SCHEMBL730079 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84
SCHEMBL9817100 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84
SCHEMBL4445935 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84
SCHEMBL28413083 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84
SCHEMBL27700043 0.85 KCNH2 (0.50) ALDH1A1PKMHPGDKCNH2GPR84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 123 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3548574-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES Momentive Performance Materials Inc. (US) 2019-10-09 EP claimed
EP-3353236-A2 COMPOSITE PANEL MATERIAL Cytec Industrial Materials (Derby) Limited (GB) 2018-08-01 EP claimed
EP-3344676-A1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2018-07-11 EP claimed
WO-2018102509-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2018-06-07 WO claimed
WO-2017050995-A2 COMPOSITE PANEL MATERIAL CYTEC INDUSTRIAL MATERIALS (DERBY) LIMITED (GB) 2017-03-30 WO claimed
WO-2017040883-A1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2017-03-09 WO claimed
EP-1565536-A1 B-STAGEABLE DIE ATTACH ADHESIVES Henkel Corporation (US) 2005-08-24 EP claimed
WO-2004048491-A1 B-STAGEABLE DIE ATTACH ADHESIVES HENKEL CORPORATION (US) 2004-06-10 WO claimed
WO-2025224628-A1 POLYFUNCTIONAL POLY(ARYLENE ETHERS) AND CURABLE COMPOSITIONS THEREOF SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2025-10-30 WO disclosed
WO-2025084944-A1 CHEMICAL METHODS FOR CAVITATION INCEPTION IN DOWNHOLE ENVIRONMENTS Aramco Innovations LLC (RU) 2025-04-24 WO disclosed
EP-4486815-A1 COPOLYMERS DERIVED FROM DICYCLOPENTADIENE SHPP Global Technologies B.V. (NL) 2025-01-08 EP disclosed
EP-4483033-A1 SYSTEMS AND METHODS OF ACTIVATING LOSS CIRCULATION MATERIALS Saudi Arabian Oil Company (SA) 2025-01-01 EP disclosed
EP-4483035-A1 METHODS OF RADIATION ACTIVATED LOST CIRCULATION MATERIAL PREVENTION Saudi Arabian Oil Company (SA) 2025-01-01 EP disclosed
CN-113661192-B Curable composition, cured product, fiber-reinforced composite material, molded article, and method for producing same DIC株式会社 2024-12-27 CN disclosed
EP-0488275-B1 Resin-impregnated superconducting magnet coil and process for its production HITACHI LTD (JP) 1997-04-02 EP disclosed
EP-0251760-A2 Rubber composition Bridgestone Corporation (JP) 1988-01-07 EP disclosed
US-4695289-A Process for improving the colour yield and wetfastness properties of dyeings or prints produced on cellulosic fabrics with anionic dyes: treatment with cationic imidazole CIBA-GEIGY CORPORATION (US) 1987-09-22 US disclosed
US-4684736-A Bisimidazolium salts CIBA-GEIGY CORPORATION (US) 1987-08-04 US disclosed
EP-0194895-A2 2-substituted-4, 6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct SHIKOKU CHEMICALS CORPORATION (JP) 1986-09-17 EP disclosed
EP-0162241-A1 Heat-curable cyanate resin and its use in preparing composites and IPN's BAYER AG (DE) 1985-11-27 EP disclosed