SCHEMBL467643

SCHEMBL467643

CCO[Si](CCl)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20543427 0.75
SCHEMBL467619 0.73
SCHEMBL329933 0.72
SCHEMBL28126822 0.71 TSHR (0.36)
SCHEMBL338941 0.67
SCHEMBL18154753 0.65
SCHEMBL467583 0.65
SCHEMBL5008948 0.65
SCHEMBL467780 0.65
SCHEMBL28416009 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104086580-B Aryl multi-arm silane coupler and preparation method thereof 山东大学 2017-07-07 CN claimed
EP-4368654-A1 MULTI-COMPONENT CURABLE COMPOSITION Kaneka Corporation (JP) 2024-05-15 EP disclosed
WO-2024071051-A1 CURABLE COMPOSITION 株式会社カネカ 2024-04-04 WO disclosed
WO-2024056473-A1 MOISTURE-CURABLE COMPOSITION AND ADHESIVE CONTAINING THE COMPOSITION WACKER CHEMIE AG (DE) 2024-03-21 WO disclosed
WO-2024029615-A1 CURABLE COMPOSITION 株式会社カネカ 2024-02-08 WO disclosed
EP-4317222-A1 (METH)ACRYLIC ACID ESTER-BASED COPOLYMER AND CURABLE COMPOSITION Kaneka Corporation (JP) 2024-02-07 EP disclosed
EP-4317207-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF Kaneka Corporation (JP) 2024-02-07 EP disclosed
US-20240018287-A1 (METH)ACRYLIC ESTER COPOLYMER AND CURABLE COMPOSITION KANEKA CORPORATION (JP) 2024-01-18 US disclosed
US-11859037-B2 Reactive silicon group-containing polymer and curable composition KANEKA CORPORATION (JP) 2024-01-02 US disclosed
WO-2023233962-A1 ADHESIVE COMPOSITION AND ARTICLE AGC株式会社 2023-12-07 WO disclosed
EP-2386561-A1 Methods for producing alkoxyhydrosilanes Kaneka Corporation (JP) 2011-11-16 EP disclosed
US-8039142-B2 Battery case SONY CORPORATION (JP) 2011-10-18 US disclosed
US-20110207886-A1 Method for Producing a-hereto-Substituted Alkylhalohydrosilane and Use Thereof KANEKA CORPORATION (JP) 2011-08-25 US disclosed
EP-2308884-A1 METHOD FOR PRODUCING -HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF Kaneka Corporation (JP) 2011-04-13 EP disclosed
US-20090247712-A1 CURABLE ORGANIC POLYMER AND METHOD FOR PRODUCTION THEREOF, AND CURABLE COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2009-10-01 US disclosed
EP-2080777-A1 HARDENING ORGANIC POLYMER, PROCESS FOR PRODUCING THE SAME, AND HARDENING COMPOSITION CONTAINING THE POLYMER Kaneka Corporation (JP) 2009-07-22 EP disclosed
US-7312013-B2 Photoreactive composition SEKISUI CHEMICAL CO., LTD. (JP) 2007-12-25 US disclosed
US-20040202956-A1 a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films SEKISUI CHEMICAL CO., LTD. (JP) 2004-10-14 US disclosed
CN-1524104-A Photoreactive composition ��Ԩ��ѧ��ҵ��ʽ���� 2004-08-25 CN disclosed
EP-1391476-A1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-25 EP disclosed