SCHEMBL467780

SCHEMBL467780

CO[Si](CCl)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15015695 0.72
SCHEMBL467779 0.69
SCHEMBL5143006 0.67
SCHEMBL15015583 0.67
SCHEMBL467710 0.61
SCHEMBL467722 0.61
Methoxymethane SCHEMBL2774166 0.59
SCHEMBL717 0.56
Ethyl Chloride SCHEMBL4613925 0.56
SCHEMBL5308881 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 243 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113166395-B Polyoxyalkylene polymer and curable composition 株式会社钟化 2024-01-05 CN claimed
CN-116234874-B Curable composition 株式会社钟化 2024-07-19 CN disclosed
EP-3808792-B1 AQUEOUS EMULSION OF POLYETHER HAVING AT LEAST ONE REACTIVE SILYL GROUP KANEKA BELGIUM NV (BE) 2024-07-03 EP disclosed
CN-118271531-A Photo-moisture curable resin composition, adhesive for electronic component, cured body, and electronic component 积水化学工业株式会社 2024-07-02 CN disclosed
WO-2024135214-A1 EMULSION COMPOSITION AND PRODUCTION METHOD THEREFOR 株式会社カネカ 2024-06-27 WO disclosed
CN-118251461-A Multi-agent type curable composition 株式会社钟化 2024-06-25 CN disclosed
CN-118176272-A Adhesive composition for polyester 株式会社钟化 2024-06-11 CN disclosed
CN-116075368-B Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2024-06-11 CN disclosed
CN-113025021-B Curable composition 株式会社钟化 2024-06-04 CN disclosed
CN-118103451-A Multi-agent type curable composition and use thereof 株式会社钟化 2024-05-28 CN disclosed
CN-103068922-A Curable composition KANEKA CORP 2013-04-24 CN disclosed
US-20120196981-A1 METHOD FOR PRODUCING a-HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF KANEKACORPORATION (JP) 2012-08-02 US disclosed
WO-2012070666-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2012-05-31 WO disclosed
EP-2392600-A1 Polymer having a reactive silicon-containing group, methods for its preparation and a curable composition comprising the polymer Kaneka Corporation (JP) 2011-12-07 EP disclosed
EP-2386561-A1 Methods for producing alkoxyhydrosilanes Kaneka Corporation (JP) 2011-11-16 EP disclosed
US-8039142-B2 Battery case SONY CORPORATION (JP) 2011-10-18 US disclosed
US-20110207886-A1 Method for Producing a-hereto-Substituted Alkylhalohydrosilane and Use Thereof KANEKA CORPORATION (JP) 2011-08-25 US disclosed
EP-2308884-A1 METHOD FOR PRODUCING -HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF Kaneka Corporation (JP) 2011-04-13 EP disclosed
US-20090247712-A1 CURABLE ORGANIC POLYMER AND METHOD FOR PRODUCTION THEREOF, AND CURABLE COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2009-10-01 US disclosed
EP-2080777-A1 HARDENING ORGANIC POLYMER, PROCESS FOR PRODUCING THE SAME, AND HARDENING COMPOSITION CONTAINING THE POLYMER Kaneka Corporation (JP) 2009-07-22 EP disclosed