⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3991107 | 0.67 | — | — | |
| SCHEMBL467780 | 0.61 | — | — | |
| SCHEMBL467710 | 0.61 | — | — | |
| SCHEMBL340980 | 0.59 | — | — | |
| SCHEMBL15015695 | 0.57 | — | — | |
| Ethylamine SCHEMBL230393 | 0.56 | — | — | |
| SCHEMBL216478 | 0.56 | — | — | |
| SCHEMBL3467059 | 0.56 | — | — | |
| Fluoride SCHEMBL25198266 | 0.53 | — | — | |
| Methoxymethane SCHEMBL10903432 | 0.53 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118271531-A | Photo-moisture curable resin composition, adhesive for electronic component, cured body, and electronic component | 积水化学工业株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-118085738-A | Curable resin composition and cured body | 积水化学工业株式会社 | 2024-05-28 | — | — | CN | disclosed |
| CN-115151578-B | Photo-moisture curable resin composition, adhesive for electronic component, cured body, and electronic component | 积水化学工业株式会社 | 2024-04-23 | — | — | CN | disclosed |
| CN-117903706-A | Curable resin composition, cured product, and electronic component | 积水化学工业株式会社 | 2024-04-19 | — | — | CN | disclosed |
| CN-112673031-B | Curable resin composition and cured body | 积水化学工业株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-113557277-B | Curable resin composition, cured product, and electronic component | 积水化学工业株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117480194-A | Photo-moisture curable resin composition, adhesive for electronic component, cured body, and electronic component | 积水化学工业株式会社 | 2024-01-30 | — | — | CN | disclosed |
| WO-2024009957-A1 | LIGHT/MOISTURE CURABLE RESIN COMPOSITION, CURED PRODUCT, USE OF LIGHT/MOISTURE CURABLE RESIN COMPOSITION, AND END FACE PROTECTION METHOD | 積水化学工業株式会社 | 2024-01-11 | — | — | WO | disclosed |
| WO-2023176795-A1 | LIGHT-MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE AGENT FOR ELECTRONIC COMPONENT, AND ADHESIVE AGENT FOR DISPLAY ELEMENT | 積水化学工業株式会社 | 2023-09-21 | — | — | WO | disclosed |
| WO-2023153514-A1 | PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY ELEMENT | 積水化学工業株式会社 | 2023-08-17 | — | — | WO | disclosed |
| CN-103068922-A | Curable composition | KANEKA CORP | 2013-04-24 | — | — | CN | disclosed |
| US-20120196981-A1 | METHOD FOR PRODUCING a-HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF | KANEKACORPORATION (JP) | 2012-08-02 | — | — | US | disclosed |
| EP-2392600-A1 | Polymer having a reactive silicon-containing group, methods for its preparation and a curable composition comprising the polymer | Kaneka Corporation (JP) | 2011-12-07 | — | — | EP | disclosed |
| EP-2386561-A1 | Methods for producing alkoxyhydrosilanes | Kaneka Corporation (JP) | 2011-11-16 | — | — | EP | disclosed |
| US-8039142-B2 | Battery case | SONY CORPORATION (JP) | 2011-10-18 | — | — | US | disclosed |
| US-20110207886-A1 | Method for Producing a-hereto-Substituted Alkylhalohydrosilane and Use Thereof | KANEKA CORPORATION (JP) | 2011-08-25 | — | — | US | disclosed |
| EP-2308884-A1 | METHOD FOR PRODUCING -HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF | Kaneka Corporation (JP) | 2011-04-13 | — | — | EP | disclosed |
| US-20090247712-A1 | CURABLE ORGANIC POLYMER AND METHOD FOR PRODUCTION THEREOF, AND CURABLE COMPOSITION CONTAINING THE SAME | KANEKA CORPORATION (JP) | 2009-10-01 | — | — | US | disclosed |
| EP-2080777-A1 | HARDENING ORGANIC POLYMER, PROCESS FOR PRODUCING THE SAME, AND HARDENING COMPOSITION CONTAINING THE POLYMER | Kaneka Corporation (JP) | 2009-07-22 | — | — | EP | disclosed |
| CN-1989179-A | Cross-linkable siloxane urea copolymers | WACKER CHEMIE GMBH (DE) | 2007-06-27 | — | — | CN | disclosed |