SCHEMBL467776

SCHEMBL467776

CCOC[SiH](OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL467753 0.75 ALDH1A1 (0.30)
SCHEMBL467604 0.69
SCHEMBL2239332 0.69 ALDH1A1 (0.35)
SCHEMBL2985664 0.69
SCHEMBL5186435 0.67
Ether SCHEMBL639452 0.67 ALDH1A1 (0.33)
SCHEMBL329798 0.65
Ether SCHEMBL27678264 0.65 ALDH1A1 (0.32)
Ether SCHEMBL9798268 0.63 ALDH1A1 (0.41)
Ether SCHEMBL10681067 0.63 ALDH1A1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3808792-B1 AQUEOUS EMULSION OF POLYETHER HAVING AT LEAST ONE REACTIVE SILYL GROUP KANEKA BELGIUM NV (BE) 2024-07-03 EP disclosed
EP-4209533-B1 COMPOSITION COMPRISING POLYMER AND LIGNIN DERIVATIVE KANEKA BELGIUM NV (BE) 2024-02-28 EP disclosed
WO-2024009957-A1 LIGHT/MOISTURE CURABLE RESIN COMPOSITION, CURED PRODUCT, USE OF LIGHT/MOISTURE CURABLE RESIN COMPOSITION, AND END FACE PROTECTION METHOD 積水化学工業株式会社 2024-01-11 WO disclosed
WO-2023176795-A1 LIGHT-MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE AGENT FOR ELECTRONIC COMPONENT, AND ADHESIVE AGENT FOR DISPLAY ELEMENT 積水化学工業株式会社 2023-09-21 WO disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
WO-2023153514-A1 PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY ELEMENT 積水化学工業株式会社 2023-08-17 WO disclosed
EP-3825359-B1 STABILIZER FOR POLYETHER HAVING AT LEAST ONE REACTIVE SILYL GROUP VITO NV (BE) 2023-08-16 EP disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
EP-4209533-A1 COMPOSITION COMPRISING POLYMER AND LIGNIN DERIVATIVE Kaneka Belgium N.V. (BE) 2023-07-12 EP disclosed
EP-4209532-A1 SILYL TERMINATED POLYETHER Kaneka Belgium N.V. (BE) 2023-07-12 EP disclosed
EP-2586784-A1 METHOD FOR PRODUCING ALKOXY HYDROSILANE Kaneka Corporation (JP) 2013-05-01 EP disclosed
EP-2586783-A1 METHOD FOR PRODUCING ALKOXY HYDROSILANE Kaneka Corporation (JP) 2013-05-01 EP disclosed
US-20120196981-A1 METHOD FOR PRODUCING a-HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF KANEKACORPORATION (JP) 2012-08-02 US disclosed
EP-2392600-A1 Polymer having a reactive silicon-containing group, methods for its preparation and a curable composition comprising the polymer Kaneka Corporation (JP) 2011-12-07 EP disclosed
EP-2386561-A1 Methods for producing alkoxyhydrosilanes Kaneka Corporation (JP) 2011-11-16 EP disclosed
US-8039142-B2 Battery case SONY CORPORATION (JP) 2011-10-18 US disclosed
US-20110207886-A1 Method for Producing a-hereto-Substituted Alkylhalohydrosilane and Use Thereof KANEKA CORPORATION (JP) 2011-08-25 US disclosed
EP-2308884-A1 METHOD FOR PRODUCING -HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF Kaneka Corporation (JP) 2011-04-13 EP disclosed
US-20090247712-A1 CURABLE ORGANIC POLYMER AND METHOD FOR PRODUCTION THEREOF, AND CURABLE COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2009-10-01 US disclosed
EP-2080777-A1 HARDENING ORGANIC POLYMER, PROCESS FOR PRODUCING THE SAME, AND HARDENING COMPOSITION CONTAINING THE POLYMER Kaneka Corporation (JP) 2009-07-22 EP disclosed