SCHEMBL467808

SCHEMBL467808

SC=CCSSCC=CS

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TRPA1 O75762 1/20 0.33
ALDH1A1 P00352 1/20 0.33
CYP3A4 P08684 1/20 0.33
HPGD P15428 1/20 0.33
ALOX15 P16050 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9885791 0.72
SCHEMBL9945312 0.72
SCHEMBL7109848 0.67
SCHEMBL12809694 0.64
SCHEMBL3640609 0.61 TSHR (0.33) TRPA1ALDH1A1CYP3A4HPGDALOX15
SCHEMBL13832752 0.56
SCHEMBL4508733 0.56
SCHEMBL10395843 0.56
SCHEMBL133690 0.56
SCHEMBL252881 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 101 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024127112-A1 COMPOUNDS COMPRISING SULFUR AND (METH)ACRYLATE MOIETIES SUITABLE FOR BONDING ORGANIC POLYMERS TO METAL 3M INNOVATIVE PROPERTIES COMPANY (US) 2024-06-20 WO disclosed
US-20240141158-A1 Curable Epoxy Systems Comprising a Phenolic Polymer RAIN CARBON GERMANY GMBH (DE) 2024-05-02 US disclosed
WO-2023196026-A1 FORMULATION AND PROCESSING OF DEGRADABLE HIGH Tg EPOXY COMPOSITE THAT CAN BE DEGRADABLE AT EXTREMELY LOW TEMPERATURE CNPC USA CORPORATION (US) 2023-10-12 WO disclosed
US-20230323015-A1 Formulation and Processing of Degradable High Tg Epoxy Composite that can be degradable at Extremely Low Temperature CNPC USA CORPORATION 2023-10-12 US disclosed
EP-3926016-B1 ICEPHOBIC COATING AND COATED ARTICLES PALL CORP (US) 2023-05-24 EP disclosed
US-20230022703-A1 NOVEL BI-CONTINUOS EPOXY MICROSTRUCTURE FOR FABRICATION OF DEGRADABLE THERMOSET COMPOSITE USED IN HTHP DOWNHOLE CONDITIONS CNPC USA Corp. 2023-01-26 US disclosed
EP-4004110-A1 TEMPERATURE STABLE POLYMERIC BLENDS FOR USE IN NON-PNEUMATIC TIRES Bridgestone Americas Tire Operations, LLC (US) 2022-06-01 EP disclosed
US-20210395560-A1 ICEPHOBIC COATING AND COATED ARTICLES PALL CORPORATION 2021-12-23 US disclosed
EP-3926016-A1 ICEPHOBIC COATING AND COATED ARTICLES Pall Corporation (US) 2021-12-22 EP disclosed
WO-2021021273-A1 TEMPERATURE STABLE POLYMERIC BLENDS FOR USE IN NON-PNEUMATIC TIRES BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC (US) 2021-02-04 WO disclosed
EP-1560708-A4 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORP (US) 2007-11-21 EP disclosed
EP-1560708-A1 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORPORATION (US) 2005-08-10 EP disclosed
US-20040058133-A1 Labeling method employing two-part curable adhesives AVERY DENNISON CORPORATION 2004-03-25 US disclosed
WO-2004009348-A1 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORPORATION (US) 2004-01-29 WO disclosed
EP-1109850-A1 PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD Lord Corporation (US) 2001-06-27 EP disclosed
US-6153719-A PHOSPHORUS-CONTAINING COMPOUND HAVING AT LEAST ONE P--OH GROUP AND AT LEAST ONE ORGANIC MOIETY CHARACTERIZED BY THE PRESENCE OF AN ETHYLENICALLY UNSATURATED GROUP;PARTICULARLY USEFUL AS A SEALER FOR AN ADHESIVE JOINT. LORD CORPORATION (US) 2000-11-28 US disclosed
EP-1053271-A1 THIOL-CURED EPOXY COMPOSITION Lord Corporation (US) 2000-11-22 EP disclosed
WO-2000008086-A1 PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD LORD CORPORATION (US) 2000-02-17 WO disclosed
US-5972423-A METHOD FOR REPAIRING SURFACE OF PLASTIC AUTOMOTIVE VEHICLE PART WITHOUT THE USE OF PRIMER COMPRISING APPLYING CURABLE FILLER COMPOSITION THAT INCLUDES AN EPOXY COMPOUND, POLYTHIOL CURING AGE, AND CATALYST; THEN CURING THE COMPOSITION LORD CORPORATION (US) 1999-10-26 US disclosed
WO-1999040142-A1 THIOL-CURED EPOXY COMPOSITION LORD CORPORATION (US) 1999-08-12 WO disclosed