SCHEMBL471139

SCHEMBL471139

CC(C)(NC(C)(C)c1ccccc1)c1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNN4 O15554 5/20 0.48
MAPK1 P28482 1/20 0.48
ALDH1A1 P00352 3/20 0.44
TAAR1 Q96RJ0 1/20 0.44
ALOX15 P16050 1/20 0.44
HDAC3 O15379 1/20 0.43
HDAC4 P56524 1/20 0.43
HDAC1 Q13547 1/20 0.43
HDAC7 Q8WUI4 1/20 0.43
HDAC2 Q92769 1/20 0.43
HDAC10 Q969S8 1/20 0.43
HDAC11 Q96DB2 1/20 0.43
HDAC8 Q9BY41 1/20 0.43
HDAC6 Q9UBN7 1/20 0.43
HDAC9 Q9UKV0 1/20 0.43
HDAC5 Q9UQL6 1/20 0.43
ESR1 P03372 2/20 0.42
ESR2 Q92731 2/20 0.42
CYP3A4 P08684 1/20 0.42
TSHR P16473 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8254374 0.89 KCNN4 (0.44) KCNN4MAPK1ALDH1A1TAAR1ALOX15
SCHEMBL663244 0.80 KCNN4 (0.59) KCNN4MAPK1ALDH1A1TAAR1ALOX15
SCHEMBL1692214 0.78 TSHR (0.50) KCNN4MAPK1ALDH1A1TAAR1ALOX15
SCHEMBL10933187 0.78 HDAC3 (0.50) KCNN4MAPK1ALDH1A1TAAR1ALOX15
SCHEMBL4199607 0.78 KCNN4 (0.44) KCNN4MAPK1ALDH1A1TAAR1ALOX15
Bromide SCHEMBL5814172 0.78 KCNN4 (0.56) KCNN4MAPK1ALDH1A1TAAR1ALOX15
SCHEMBL7570225 0.78 KCNN4 (0.44) KCNN4MAPK1ALDH1A1TAAR1ALOX15
SCHEMBL8178159 0.78 TAAR1 (0.46) KCNN4MAPK1ALDH1A1TAAR1ALOX15
SCHEMBL16627084 0.78 KCNN4 (0.44) KCNN4MAPK1ALDH1A1TAAR1ALOX15
Bromide SCHEMBL5814168 0.78 KCNN4 (0.56) KCNN4MAPK1ALDH1A1TAAR1ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111148499-B Antimicrobial particles and methods of use thereof 诺比奥有限公司(IL) 2023-01-13 CN disclosed
US-8785534-B2 Use of polyamides that are resistant to corrosion and stress cracking BASF SE (DE) 2014-07-22 US disclosed
US-8785534-B2 Use of polyamides that are resistant to corrosion and stress cracking BASF SE (DE) 2014-07-22 US disclosed
EP-2553021-B1 USE OF POLYAMIDES THAT ARE RESISTANT TO CORROSION AND STRESS CRACKING BASF SE (DE) 2014-05-07 EP disclosed
US-8481652-B2 Thermoplastic polyamides having polyether amines BASF SE (DE) 2013-07-09 US disclosed
US-8481652-B2 Thermoplastic polyamides having polyether amines BASF SE (DE) 2013-07-09 US disclosed
US-20130023613-A1 USE OF POLYAMIDES THAT ARE RESISTANT TO CORROSION AND STRESS CRACKING BASF SE (DE) 2013-01-24 US disclosed
US-20130023613-A1 USE OF POLYAMIDES THAT ARE RESISTANT TO CORROSION AND STRESS CRACKING BASF SE (DE) 2013-01-24 US disclosed
WO-2013006288-A1 THIN FILM COMPOSITE MEMBRANES EMBEDDED WITH MOLECULAR CAGE COMPOUNDS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-01-10 WO disclosed
US-8197715-B2 Thermoplastic moulding compositions having improved ductility BASE SE (DE) 2012-06-12 US disclosed
EP-2049597-B1 THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS BASF SE (DE) 2010-02-24 EP disclosed
US-20100019210-A1 THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS BASF SE (DE) 2010-01-28 US disclosed
WO-2009115535-A2 POLYAMIDE NANOCOMPOSITES WITH HYPER- BRANCHED POLYETHERAMINES BASF SE (DE) 2009-09-24 WO disclosed
WO-2009115536-A1 POLYAMIDE NANOCOMPOSITES WITH HYPER-BRANCHED POLYETHYLENIMINES BASF SE (DE) 2009-09-24 WO disclosed
WO-2009077492-A2 THERMOPLASTIC POLYAMIDES HAVING POLYETHER AMINES BASF SE (DE) 2009-06-25 WO disclosed
EP-1787809-B1 Ink composition, inkjet recording method, printed material, production method of a planographic printing plate and planographic printing plate FUJIFILM CORP (JP) 2008-08-13 EP disclosed
WO-2008074687-A2 THERMOPLASTIC MOULDING COMPOSITIONS HAVING IMPROVED DUCTILITY BASF SE (DE) 2008-06-26 WO disclosed
WO-2008012233-A2 THERMOPLASTIC MOULDING COMPOSITIONS WITH HIGH STIFFNESS BASF SE (DE) 2008-01-31 WO disclosed
US-20070115326-A1 Ink composition, inkjet recording method, printed material, production method of a planographic printing plate and planographic printing plate FUJIFILM CORPORATION 2007-05-24 US disclosed
EP-1787809-A1 Ink composition, inkjet recording method, printed material, production method of a planographic printing plate and planographic printing plate Fujifilm Corporation (JP) 2007-05-23 EP disclosed