SCHEMBL4737877

SCHEMBL4737877

CNP(N)(=O)NC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL27090426 0.96
SCHEMBL36989 0.78
SCHEMBL23979444 0.77
Hydrochloric Acid SCHEMBL29190438 0.75
SCHEMBL10931634 0.72
SCHEMBL3070505 0.67
Phosphoramidic Acid SCHEMBL6853913 0.67
SCHEMBL2770615 0.65
SCHEMBL8853603 0.64
SCHEMBL3039732 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008085926-A1 PHOSPHORAMIDE ESTER FLAME RETARDANT AND RESINS CONTAINING SAME SUPRESTA LLC (US) 2008-07-17 WO claimed
EP-3865284-B1 METAL/RESIN COMPOSITE AND PRODUCTION METHOD THEREFOR DAINIPPON INK & CHEMICALS (JP) 2025-05-21 EP disclosed
EP-3865283-B1 METAL-RESIN COMPOSITE AND METHOD FOR PRODUCING SAME DAINIPPON INK & CHEMICALS (JP) 2025-05-07 EP disclosed
US-12291605-B2 Composite structure and manufacturing method thereof DIC CORPORATION (JP) 2025-05-06 US disclosed
US-11911974-B2 Metal/resin composite structure and method for manufacturing same DIC CORPORATION (JP) 2024-02-27 US disclosed
CN-113292539-B Substituted oxopyridine derivatives 拜耳制药股份公司 2023-12-22 CN disclosed
US-11766836-B2 Metal-resin composite and method for producing same DIC CORPORATION (JP) 2023-09-26 US disclosed
CN-115960901-A Phosphamide morpholino antisense oligonucleotide for resisting virus and application thereof 中国人民解放军军事科学院军事医学研究院 2023-04-14 CN disclosed
CN-111954597-B Composite structure and method for manufacturing same DIC株式会社 2023-03-21 CN disclosed
US-20230040667-A1 COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF DIC CORPORATION (JP) 2023-02-09 US disclosed
US-11565480-B2 Metal-resin composite and method for producing same DIC CORPORATION (JP) 2023-01-31 US disclosed
EP-4082746-A1 COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREFOR DIC Corporation (JP) 2022-11-02 EP disclosed
CN-114901458-A Composite structure and method for manufacturing same DIC株式会社 2022-08-12 CN disclosed
US-20210347130-A1 METAL-RESIN COMPOSITE AND METHOD FOR PRODUCING SAME DIC CORPORATION (JP) 2021-11-11 US disclosed
US-20210347127-A1 METAL-RESIN COMPOSITE AND METHOD FOR PRODUCING SAME DIC CORPORATION (JP) 2021-11-11 US disclosed
EP-3865284-A1 METAL/RESIN COMPOSITE AND PRODUCTION METHOD THEREFOR DIC Corporation (JP) 2021-08-18 EP disclosed
EP-3865283-A1 METAL-RESIN COMPOSITE AND METHOD FOR PRODUCING SAME DIC Corporation (JP) 2021-08-18 EP disclosed
EP-3575077-B1 METAL/RESIN COMPOSITE STRUCTURE AND METHOD FOR MANUFACTURING SAME DAINIPPON INK & CHEMICALS (JP) 2021-08-04 EP disclosed
CN-111954597-A Composite structure and method for manufacturing same DIC株式会社 2020-11-17 CN disclosed