SCHEMBL4743717

SCHEMBL4743717

C=CP(=O)(O)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28455581 0.96
SCHEMBL9446017 0.78 ALOX15 (0.39)
SCHEMBL26932 0.78
Water SCHEMBL5590072 0.75
Hydrochloric Acid SCHEMBL7086640 0.75
Hydrochloric Acid SCHEMBL8976680 0.75
SCHEMBL4350862 0.75
Ammonia Solution, Strong SCHEMBL2733996 0.75
SCHEMBL337626 0.75
SCHEMBL7880214 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 103 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103199232-B Surface-modified lithium titanate and preparation method thereof NINGDE AMPEREX TECHNOLOGY LTD 2015-05-13 CN claimed
CN-103199232-A Surface-modified lithium titanate and preparation method thereof NINGDE AMPEREX TECHNOLOGY LTD 2013-07-10 CN claimed
EP-0742263-B1 Silyl phosphonate as stabilizing agent for polydiorganosiloxanes DOW CORNING (US) 1999-06-02 EP claimed
WO-2025126952-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE 株式会社レゾナック 2025-06-19 WO disclosed
US-12324105-B2 Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package RESONAC CORPORATION (JP) 2025-06-03 US disclosed
CN-120040637-A Organic phosphonic acid polymer flame retardant, and preparation method and application thereof 威海海润新材料科技有限公司 2025-05-27 CN disclosed
US-12264224-B2 Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package RESONAC CORPORATION (JP) 2025-04-01 US disclosed
CN-119490747-A Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board 广东生益科技股份有限公司 2025-02-21 CN disclosed
CN-116410596-B Resin composition and application thereof 广东生益科技股份有限公司 2025-02-14 CN disclosed
CN-116410595-B Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2025-02-14 CN disclosed
US-12024624-B2 Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package RESONAC CORPORATION (JP) 2024-07-02 US disclosed
US-7348396-B2 Modified polyethylenephosphinic acids and their salts CLARIANT PRODUKTE (DEUTSCHLAND) GMBH (DE) 2008-03-25 US disclosed
WO-2007057690-A1 DESYMMETRISATION PROCESS FOR THE PRODUCTION OF CYCLIC PHOSPHINES USED AS LIGANDS IN ENANTIOSELECTIVE SYNTHESIS CATALYSTS ISIS INNOVATION LIMITED (GB) 2007-05-24 WO disclosed
WO-2007057690-A1 DESYMMETRISATION PROCESS FOR THE PRODUCTION OF CYCLIC PHOSPHINES USED AS LIGANDS IN ENANTIOSELECTIVE SYNTHESIS CATALYSTS ISIS INNOVATION LIMITED (GB) 2007-05-24 WO disclosed
US-20070027297-A1 Modified polyethylenephosphinic acids and their salts CLARIANT FINANCE (BVI) LIMITED 2007-02-01 US disclosed
US-7129320-B2 Modified polyethylenephosphinic acids and their salts CLARIANT GMBH (DE) 2006-10-31 US disclosed
US-20040176580-A1 Modified polyethylenephosphinic acids and their salts CLARIANT GMBH 2004-09-09 US disclosed
US-6727335-B2 REACTING HYPOPHOSPHOROUS ACID AND/OR ALKALI METAL SALTS WITH ACETYLENES; FIREPROOFING CLARIANT GMBH (DE) 2004-04-27 US disclosed
US-20030216533-A1 Polymeric phosphinic acids and salts thereof CLARIANT GMBH 2003-11-20 US disclosed
US-6569974-B1 Organophosphorous polymer; flame retarders CLARIANT GMBH (DE) 2003-05-27 US disclosed