Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.44 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.34 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.34 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.34 |
| ▸ | TBXA2R | P21731 | 1/20 | 0.34 |
| ▸ | GALR3 | O60755 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | BLM | P54132 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1585487 | 0.75 | TSHR (0.52) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL14752948 | 0.75 | TSHR (0.52) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL10297388 | 0.73 | TSHR (0.50) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL16250316 | 0.73 | TSHR (0.50) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL10297387 | 0.73 | TSHR (0.50) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL3341119 | 0.72 | KCNH2 (0.37) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL7040467 | 0.71 | TSHR (0.48) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL10329372 | 0.71 | TSHR (0.48) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| Ammonia Solution, Strong SCHEMBL29031745 | 0.71 | TSHR (0.48) | TSHRCHRM2CHRM4CHRM1TBXA2R | |
| SCHEMBL11684627 | 0.71 | TSHR (0.38) | TSHRCHRM2CHRM4CHRM1TBXA2R |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2412011-B1 | CHEMICAL VAPOR DEPOSITION METHOD | TOKYO ELECTRON LTD (JP) | 2017-09-20 | — | — | EP | claimed |
| US-9212420-B2 | Chemical vapor deposition method | TOKYO ELECTRON LIMITED (JP) | 2015-12-15 | — | — | US | claimed |
| EP-1482070-B1 | MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS | AIR PROD & CHEM (US) | 2015-11-11 | — | — | EP | claimed |
| EP-2412011-A1 | CHEMICAL VAPOR DEPOSITION METHOD | Tokyo Electron Limited (JP) | 2012-02-01 | — | — | EP | claimed |
| US-20100247803-A1 | Chemical vapor deposition method | TOKYO ELECTRON LIMITED (JP) | 2010-09-30 | — | — | US | claimed |
| WO-2010111313-A1 | CHEMICAL VAPOR DEPOSITION METHOD | TOKYO ELECTRON LIMITED (JP) | 2010-09-30 | — | — | WO | claimed |
| US-20090096106-A1 | ANTIREFLECTIVE COATINGS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-04-16 | — | — | US | claimed |
| EP-2048700-A2 | Antireflective coatings | Air Products and Chemicals, Inc. (US) | 2009-04-15 | — | — | EP | claimed |
| US-11164739-B2 | Use of silicon structure former with organic substituted hardening additive compounds for dense OSG films | VERSUM MATERIALS US, LLC (US) | 2021-11-02 | — | — | US | disclosed |
| US-20190244810-A1 | Use of Silicon Structure Former with Organic Substituted Hardening Additive Compounds for Dense OSG Films | VERSUM MATERIALS US, LLC (US) | 2019-08-08 | — | — | US | disclosed |
| EP-3121310-B1 | METHOD FOR REMOVAL OF CARBON FROM AN ORGANOSILICATE MATERIAL | VERSUM MAT US LLC (US) | 2018-02-28 | — | — | EP | disclosed |
| EP-2199428-B1 | Method for removal of carbon from an organosilicate material | VERSUM MAT US LLC (US) | 2018-01-24 | — | — | EP | disclosed |
| EP-2412011-B1 | CHEMICAL VAPOR DEPOSITION METHOD | TOKYO ELECTRON LTD (JP) | 2017-09-20 | — | — | EP | disclosed |
| EP-3211121-A2 | METHOD FOR REMOVAL OF CARBON FROM AN ORGANOSILICATE MATERIAL | Air Products and Chemicals, Inc. (US) | 2017-08-30 | — | — | EP | disclosed |
| US-6846515-B2 | Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-01-25 | — | — | US | disclosed |
| US-20040241463-A1 | Mechanical enhancer additives for low dielectric films | VERSUM MATERIALS US, LLC | 2004-12-02 | — | — | US | disclosed |
| EP-1482070-A1 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-12-01 | — | — | EP | disclosed |
| US-20030232137-A1 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | VERSUM MATERIALS US, LLC | 2003-12-18 | — | — | US | disclosed |
| US-20030198742-A1 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | VERSUM MATERIALS US, LLC | 2003-10-23 | — | — | US | disclosed |
| EP-1354980-A1 | Method for forming a porous SiOCH layer. | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2003-10-22 | — | — | EP | disclosed |