⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11265969 | 0.70 | — | — | |
| SCHEMBL11265970 | 0.70 | — | — | |
| Glyoxylate SCHEMBL2452312 | 0.70 | — | — | |
| Fumaric Acid SCHEMBL144529 | 0.70 | — | — | |
| SCHEMBL1803797 | 0.70 | — | — | |
| Fumaric Acid SCHEMBL28495094 | 0.70 | TSHR (0.90) | — | |
| Fumaric Acid SCHEMBL144528 | 0.70 | — | — | |
| Maleic Acid SCHEMBL1208678 | 0.70 | — | — | |
| Acrylic Acid SCHEMBL465107 | 0.67 | — | — | |
| Bicarbonate SCHEMBL28366723 | 0.65 | CA1 (0.83) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107207868-B | Resin composition, resin film, and electronic component | 日本瑞翁株式会社 | 2020-11-06 | — | — | CN | claimed |
| US-10151977-B2 | Resin composition, resin film, and electronic device | ZEON CORPORATION (JP) | 2018-12-11 | — | — | US | claimed |
| US-20180022912-A1 | RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | ZEON CORPORATION (JP) | 2018-01-25 | — | — | US | claimed |
| CN-108779317-B | Resin composition, resin film, and electronic component | 日本瑞翁株式会社 | 2021-04-16 | — | — | CN | disclosed |
| CN-107207868-B | Resin composition, resin film, and electronic component | 日本瑞翁株式会社 | 2020-11-06 | — | — | CN | disclosed |
| US-10151977-B2 | Resin composition, resin film, and electronic device | ZEON CORPORATION (JP) | 2018-12-11 | — | — | US | disclosed |
| US-20180022912-A1 | RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | ZEON CORPORATION (JP) | 2018-01-25 | — | — | US | disclosed |
| US-9798233-B2 | Radiation-sensitive resin composition and electronic device | ZEON CORPORATION (JP) | 2017-10-24 | — | — | US | disclosed |
| US-9617408-B2 | Resin composition and gate insulating film | ZEON CORPORATION (JP) | 2017-04-11 | — | — | US | disclosed |
| US-20160202607-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE | ZEON CORPORATION (JP) | 2016-07-14 | — | — | US | disclosed |
| US-20160160012-A1 | RESIN COMPOSITION AND GATE INSULATING FILM | ZEON CORPORATION (JP) | 2016-06-09 | — | — | US | disclosed |
| US-20140154627-A1 | NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | ZEON CORPORATION (JP) | 2014-06-05 | — | — | US | disclosed |
| US-20140087136-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD | ZEON CORPORATION (JP) | 2014-03-27 | — | — | US | disclosed |
| WO-2008123233-A1 | RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE MATRIX SUBSTRATE AND METHOD FOR PRODUCING THE SAME | ZEON CORPORATION (JP) | 2008-10-16 | — | — | WO | disclosed |