SCHEMBL475440

SCHEMBL475440

CCCC(C(=O)O)C(C(=O)O)[Si](OC)(OC)OC

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CHRM1 P11229 1/20 0.40
AKR1A1 P14550 1/20 0.40
CHRM3 P20309 1/20 0.40
HTR2A P28223 1/20 0.40
HTR2C P28335 1/20 0.40
ADRA1A P35348 1/20 0.40
HRH1 P35367 1/20 0.40
DRD3 P35462 1/20 0.40
SLC6A3 Q01959 1/20 0.40
HDAC1 Q13547 1/20 0.40
HDAC2 Q92769 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
GPR84 Q9NQS5 3/20 0.34
FFAR1 O14842 1/20 0.34
GRIK1 P39086 1/20 0.32
SLC1A3 P43003 1/20 0.32
SLC1A2 P43004 1/20 0.32
SLC1A1 P43005 1/20 0.32
GRIK2 Q13002 1/20 0.32
CA2 P00918 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL475635 0.83 CHRM1 (0.39) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL475642 0.83 CHRM1 (0.39) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL28404949 0.75 PPARG (0.41) TDP1
SCHEMBL475448 0.74 CHRM1 (0.38) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL28165475 0.74 CHRM1 (0.44) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL14110749 0.73 TDP1 (0.60) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL5031485 0.73 TDP1 (0.60) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL28212336 0.71 TDP1 (0.57) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL13752800 0.69 CHRM1 (0.44) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL4756212 0.69 CHRM1 (0.44) CHRM1AKR1A1CHRM3HTR2AHTR2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111095566-B Field effect transistor, method of manufacturing the same, wireless communication device using the same, and merchandise tag 东丽株式会社 2023-05-23 CN disclosed
CN-109964327-B Field-effect transistor, method for manufacturing same, wireless communication device using same, and commodity label 东丽株式会社 2020-05-19 CN disclosed
CN-111095566-A Field-effect transistor, method for manufacturing the same, and wireless communication device and merchandise tag using the same 东丽株式会社 2020-05-01 CN disclosed
CN-109964327-A Field effect transistor, its manufacturing method, wireless telecom equipment and Commercial goods labels using it 东丽株式会社 2019-07-02 CN disclosed
US-10324376-B2 Negative type colored photosensitive resin composition, cured film, element, and display device TORAY INDUSTRIES, INC. (JP) 2019-06-18 US disclosed
CN-109804310-A Negative light-sensitive resin combination, cured film, the element for having cured film and display device and its manufacturing method 东丽株式会社 2019-05-24 CN disclosed
CN-108885399-A Negative light-sensitive resin combination, cured film, the display device and its manufacturing method for having cured film 东丽株式会社 2018-11-23 CN disclosed
US-20180267405-A1 NEGATIVE TYPE COLORED PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2018-09-20 US disclosed
CN-108027561-A Negative light-sensitive resin combination, cured film, the element for possessing cured film and display device and its manufacture method 东丽株式会社 2018-05-11 CN disclosed
CN-106661328-A Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2017-05-10 CN disclosed
CN-106574116-A Curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2017-04-19 CN disclosed
CN-106574117-A Curable composition, method of producing curable composition, cured material, method of using curable composition, and optical device 琳得科株式会社 2017-04-19 CN disclosed
US-9309348-B2 Adhesive composition NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2016-04-12 US disclosed
US-8927071-B2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive and optical film NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2015-01-06 US disclosed
EP-2412776-A1 ADHESIVE COMPOSITION Nippon Carbide Industries Co., Inc. (JP) 2012-02-01 EP disclosed
US-20120010341-A1 ADHESIVE COMPOSITION NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2012-01-12 US disclosed