Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FOLH1 | Q04609 | 10/20 | 0.46 |
| ▸ | CA2 | P00918 | 1/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | CPA1 | P15085 | 2/20 | 0.33 |
| ▸ | CPB1 | P15086 | 1/20 | 0.33 |
| ▸ | CPA3 | P15088 | 1/20 | 0.33 |
| ▸ | CPB2 | Q96IY4 | 1/20 | 0.33 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.32 |
| ▸ | AKR1A1 | P14550 | 1/20 | 0.32 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.32 |
| ▸ | HTR2A | P28223 | 1/20 | 0.32 |
| ▸ | HTR2C | P28335 | 1/20 | 0.32 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.32 |
| ▸ | HRH1 | P35367 | 1/20 | 0.32 |
| ▸ | DRD3 | P35462 | 1/20 | 0.32 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.32 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21402783 | 0.95 | FOLH1 (0.44) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL21402786 | 0.93 | FOLH1 (0.43) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL21402779 | 0.93 | FOLH1 (0.43) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL21402787 | 0.89 | FOLH1 (0.48) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL20492090 | 0.86 | FOLH1 (0.46) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL786839 | 0.85 | FOLH1 (0.44) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL475437 | 0.84 | FOLH1 (0.47) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL475445 | 0.83 | FOLH1 (0.43) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL787058 | 0.82 | FOLH1 (0.52) | FOLH1CA2MAPK1MEN1GAA | |
| SCHEMBL17363668 | 0.82 | MMP2 (0.43) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11822243-B2 | Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor | TORAY INDUSTRIES, INC. (JP) | 2023-11-21 | — | — | US | disclosed |
| CN-111095566-B | Field effect transistor, method of manufacturing the same, wireless communication device using the same, and merchandise tag | 东丽株式会社 | 2023-05-23 | — | — | CN | disclosed |
| CN-109804310-B | Negative photosensitive resin composition, cured film, element and display device provided with cured film, and method for producing same | 东丽株式会社 | 2022-09-30 | — | — | CN | disclosed |
| CN-114460809-A | Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same | 东丽株式会社 | 2022-05-10 | — | — | CN | disclosed |
| CN-108885399-B | Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same | 东丽株式会社 | 2022-03-15 | — | — | CN | disclosed |
| CN-108027561-B | Negative photosensitive resin composition, cured film, element and display device provided with cured film, and method for producing same | 东丽株式会社 | 2021-10-08 | — | — | CN | disclosed |
| US-10983436-B2 | Negative-type photosensitive resin composition, cured film, display device provided with cured film, and production method therefor | TORAY INDUSTRIES, INC. (JP) | 2021-04-20 | — | — | US | disclosed |
| US-20210011381-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME | TORAY INDUSTRIES, INC. (JP) | 2021-01-14 | — | — | US | disclosed |
| US-10802401-B2 | Negative-type photosensitive resin composition, cured film, element and display apparatus that include cured film, production method for the same | TORAY INDUSTRIES, INC. (JP) | 2020-10-13 | — | — | US | disclosed |
| US-10790461-B2 | Field-effect transistor, method for manufacturing the same, and wireless communication device and goods tag including the same | TORAY INDUSTRIES, INC. (JP) | 2020-09-29 | — | — | US | disclosed |
| EP-3547383-A1 | FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING SAME, WIRELESS COMMUNICATION DEVICE USING SAME AND ARTICLE TAG | Toray Industries, Inc. (JP) | 2019-10-02 | — | — | EP | disclosed |
| US-20190258164-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY DEVICE PROVIDED WITH CURED FILM, AND PRODUCTION METHOD THEREFOR | TORAY INDUSTRIES, INC. (JP) | 2019-08-22 | — | — | US | disclosed |
| US-20190072851-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY DEVICE PROVIDED WITH CURED FILM, AND PRODUCTION METHOD THEREFOR | TORAY INDUSTRIES, INC. (JP) | 2019-03-07 | — | — | US | disclosed |
| US-20180259852-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME | TORAY INDUSTRIES, INC. (JP) | 2018-09-13 | — | — | US | disclosed |
| US-9309348-B2 | Adhesive composition | NIPPON CARBIDE INDUSTRIES CO., INC. (JP) | 2016-04-12 | — | — | US | disclosed |
| US-8927071-B2 | Pressure-sensitive adhesive composition, pressure-sensitive adhesive and optical film | NIPPON CARBIDE INDUSTRIES CO., INC. (JP) | 2015-01-06 | — | — | US | disclosed |
| EP-2412776-A1 | ADHESIVE COMPOSITION | Nippon Carbide Industries Co., Inc. (JP) | 2012-02-01 | — | — | EP | disclosed |
| US-20120010341-A1 | ADHESIVE COMPOSITION | NIPPON CARBIDE INDUSTRIES CO., INC. (JP) | 2012-01-12 | — | — | US | disclosed |
| US-20110236605-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE AND OPTICAL FILM | NIPPON CARBIDE INDUSTRIES CO., INC. (JP) | 2011-09-29 | — | — | US | disclosed |
| EP-2330170-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE AND OPTICAL FILM | Nippon Carbide Industries Co., Inc. (JP) | 2011-06-08 | — | — | EP | disclosed |