⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14902958 | 1.00 | — | — | |
| SCHEMBL9004508 | 1.00 | — | — | |
| SCHEMBL9004497 | 1.00 | — | — | |
| SCHEMBL9178213 | 1.00 | — | — | |
| SCHEMBL11950506 | 1.00 | — | — | |
| SCHEMBL9004474 | 1.00 | — | — | |
| SCHEMBL9004473 | 1.00 | — | — | |
| SCHEMBL9004493 | 1.00 | — | — | |
| SCHEMBL3868343 | 1.00 | — | — | |
| SCHEMBL9004501 | 1.00 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20140342530-A1 | TEMPORARY ADHESIVE MATERIAL FOR WAFER, FILM FOR TEMPORARY ADHESION USING SAME, WAFER PROCESSING LAMINATE, AND METHOD FOR PRODUCING THIN WAFER USING SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-11-20 | — | — | US | disclosed |
| US-8889810-B2 | Adhesive composition and adhesive dry film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-11-18 | — | — | US | disclosed |
| US-8865391-B2 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8808865-B2 | Adhesive composition, and adhesive sheet, semiconductor apparatus-protective material and semiconductor apparatus using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-08-19 | — | — | US | disclosed |
| US-20140154868-A1 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHERING MATERIAL FOR PROCESSING WAFER, AND MANUFACTURING METHOD OF THIN WAFER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-06-05 | — | — | US | disclosed |
| US-8729148-B2 | Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-20 | — | — | US | disclosed |
| US-20130302983-A1 | TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSING USING THE SAME, WAFER PROCESSED BODY, AND METHOD FOR PRODUCING THIN WAFER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-11-14 | — | — | US | disclosed |
| US-20130289225-A1 | ADHESIVE COMPOSITION, AND ADHESIVE SHEET, SEMICONDUCTOR APPARATUS-PROTECTIVE MATERIAL AND SEMICONDUCTOR APPARATUS USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-10-31 | — | — | US | disclosed |
| US-20130220687-A1 | WAFER PROCESS BODY, WAFER PROCESSING MEMBER, WAFER PROCESSING TEMPORARY ADHESIVE MATERIAL, AND METHOD FOR MANUFACTURING THIN WAFER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-08-29 | — | — | US | disclosed |
| US-8501879-B2 | Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-08-06 | — | — | US | disclosed |
| US-8481244-B2 | Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-07-09 | — | — | US | disclosed |
| US-20130149493-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-06-13 | — | — | US | disclosed |
| US-20130149645-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-06-13 | — | — | US | disclosed |
| US-20130108866-A1 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDING ARRANGEMENT, AND THIN WAFER MANUFACTURING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-05-02 | — | — | US | disclosed |
| US-20120235284-A1 | FILM-LIKE WAFER MOLD MATERIAL, MOLDED WAFER, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-09-20 | — | — | US | disclosed |
| US-20120213993-A1 | ADHESIVE COMPOSITION AND ADHESIVE DRY FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-08-23 | — | — | US | disclosed |
| US-20120108762-A1 | ADHESIVE COMPOSITION, ADHESIVE SHEET, SEMICONDUCTOR APPARATUS PROTECTION MATERIAL, AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-05-03 | — | — | US | disclosed |
| US-20110143092-A1 | PHOTOCURABLE DRY FILM, METHOD FOR PREPARING SAME, PATTERNING METHOD AND FILM FOR PROTECTING ELECTRIC AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |
| US-20110076465-A1 | EPOXY-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTIVE FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-03-31 | — | — | US | disclosed |