SCHEMBL476166

SCHEMBL476166

Cc1c(N)c(N)cc(C(CC2CO2)(CC2CO2)CC2CO2)c1CC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15050578 0.89
SCHEMBL18318334 0.72 ESR1 (0.34)
SCHEMBL3415653 0.70 ALDH1A1 (0.36)
SCHEMBL3180847 0.69
SCHEMBL138977 0.69
SCHEMBL23094088 0.68 CYP3A4 (0.32)
SCHEMBL18319153 0.67 ESR1 (0.35)
SCHEMBL16752015 0.67 ESR1 (0.36)
SCHEMBL16752000 0.67 ESR1 (0.36)
SCHEMBL1487504 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118084793-A Diamine monomer containing imidazole structure, and preparation method and application thereof 波米科技有限公司 2024-05-28 CN claimed
CN-110564347-A One-component epoxy structure adhesive for waterproof sealing and preparation method thereof 上海汉司实业有限公司 2019-12-13 CN claimed
US-20260008226-A1 ADDITIVE MANUFACTURING USING REACTIVE COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2026-01-08 US disclosed
US-12384097-B2 Additive manufacturing using reactive compositions PPG INDUSTRIES OHIO, INC. (US) 2025-08-12 US disclosed
CN-115702270-B Fiber bundling agent, fiber material, molding material, and molded article DIC株式会社 2025-04-04 CN disclosed
CN-119058235-A Fluid ejection head, method for manufacturing fluid ejection head, fluid ejection assembly, and fluid ejection device 株式会社理光 2024-12-03 CN disclosed
WO-2024182010-A1 SELF-STRATIFYING ADHESION PROMOTER FOR ENHANCED INTERCOAT ADHESION PRC-DESOTO INTERNATIONAL, INC. (US) 2024-09-06 WO disclosed
US-20240239960-A1 MULTIPLE CURE COREACTIVE COMPOSITIONS FOR ADDITIVE MANUFACTURING AND USES THEREOF PPG INDUSTRIES OHIO, INC. (US) 2024-07-18 US disclosed
US-20240199911-A1 HYBRID DUAL CURE COMPOSITIONS PRC-DESOTO INTERNATIONAL, INC. (US) 2024-06-20 US disclosed
CN-118084793-A Diamine monomer containing imidazole structure, and preparation method and application thereof 波米科技有限公司 2024-05-28 CN disclosed
EP-4330311-A1 MULTIPLE CURE COREACTIVE COMPOSITIONS FOR ADDITIVE MANUFACTURING AND USES THEREOF PPG Industries Ohio Inc. (US) 2024-03-06 EP disclosed
US-20050095530-A1 Dye-containing resist composition and color filter using same NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-05-05 US disclosed
EP-1508835-A2 Dye-containing resist composition and color filter using same NISSAN CHEMICAL INDUSTRIES, LIMITED (JP) 2005-02-23 EP disclosed
EP-0583224-B1 Thermosetting resins toughened with sulfone polymers HEXCEL CORP (US) 1999-01-20 EP disclosed
EP-0602647-B1 Superconducting magnet, superconducting magnet coil, and manufacturing method thereof HITACHI LTD (JP) 1998-04-29 EP disclosed
US-5606300-A FIXING RESIN WHICH SUPPRESSES MICROCRACKING HITACHI, LTD. (JP) 1997-02-25 US disclosed
EP-0602647-A1 Superconducting magnet, superconducting magnet coil, and manufacturing method thereof HITACHI, LTD. (JP) 1994-06-22 EP disclosed
EP-0241027-A2 An adhesive composition Takeda Chemical Industries, Ltd. (JP) 1987-10-14 EP disclosed
EP-0072473-B1 ORGANOSILICONE COATING COMPOSITION Treadway, Gerald D. (US) 1986-02-05 EP disclosed
EP-0072473-A2 Organosilicone coating composition Treadway, Gerald D. (US) 1983-02-23 EP disclosed