SCHEMBL476658

SCHEMBL476658

CCCCCCCCCCOP(OCCCCCCCC)OCCCCCCCCCC

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.47
TSHR P16473 1/20 0.47
MEN1 O00255 1/20 0.42
HTT P42858 1/20 0.42
KMT2A Q03164 1/20 0.42
MAPT P10636 1/20 0.42
CA1 P00915 8/20 0.41
CA2 P00918 8/20 0.41
CA9 Q16790 7/20 0.41
LPAR3 Q9UBY5 6/20 0.41
LPAR2 Q9HBW0 5/20 0.41
CA12 O43570 3/20 0.41
CA7 P43166 3/20 0.41
CA14 Q9ULX7 3/20 0.41
LPAR1 Q92633 2/20 0.41
CA3 P07451 2/20 0.41
CA4 P22748 2/20 0.41
CA6 P23280 2/20 0.41
CA5A P35218 2/20 0.41
CA5B Q9Y2D0 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11586951 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL39213 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL11677867 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL10390885 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL11355583 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL6740549 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL9604899 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL39064 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL100286 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL9294081 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021162358-A1 LOW-PERMITTIVITY DIELECTRIC COMPOSITION FOR DISPLAY DIELECTRIC FILM, METHOD FOR MANUFACTURING LOW-PERMITTIVITY DIELECTRIC FILM FOR DISPLAY AND DISPLAY DEVICE USING SAME 한양대학교 산학협력단 2021-08-19 WO disclosed
US-20140367670-A1 SURFACE SEALING AGENT FOR ORGANIC EL ELEMENT, ORGANIC EL DEVICE USING SAME, AND MANUFACTURING METHOD FOR SAME MITSUI CHEMICALS, INC. (JP) 2014-12-18 US disclosed
EP-2289998-B1 White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device SHINETSU CHEMICAL CO (JP) 2012-02-01 EP disclosed
US-8044128-B2 White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-10-25 US disclosed
US-20110054072-A1 WHITE HEAT-CURABLE SILICONE/EPOXY HYBRID RESIN COMPOSITION FOR OPTOELECTRONIC USE, MAKING METHOD, PREMOLDED PACKAGE, AND LED DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-03-03 US disclosed
EP-2289998-A1 White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device Shin-Etsu Chemical Co., Ltd. (JP) 2011-03-02 EP disclosed