SCHEMBL4778593

SCHEMBL4778593

C=[C]CCCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1595428 0.90
SCHEMBL9065875 0.87
SCHEMBL3084471 0.87
SCHEMBL572518 0.77
SCHEMBL15923194 0.76
SCHEMBL3401234 0.69 ALDH1A1 (0.35)
SCHEMBL4048169 0.67
SCHEMBL4667202 0.67
SCHEMBL9111110 0.64
SCHEMBL4521757 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105778007-A Polymer, preparation method thereof, and water reducer comprising same 辽宁奥克化学股份有限公司 2016-07-20 CN claimed
CN-108371657-B Preparation method of esomeprazole magnesium enteric-coated pellet 乐清市然景电气有限公司 2021-11-19 CN disclosed
CN-113318087-A Preparation method of esomeprazole magnesium enteric-coated pellet 苏州逸纪杰电子科技有限公司 2021-08-31 CN disclosed
CN-110225945-A Composition and film 大金工业株式会社 2019-09-10 CN disclosed
CN-107108850-B Curable resin composition AGC株式会社 2019-08-16 CN disclosed
CN-108779208-A Polymer, composition, coating film, laminate, back sheet, and solar cell module 大金工业株式会社 2018-11-09 CN disclosed
CN-108371657-A Preparation method of esomeprazole magnesium enteric-coated pellet 苏州逸纪杰电子科技有限公司 2018-08-07 CN disclosed
CN-107108850-A Curable resin composition 旭硝子株式会社 2017-08-29 CN disclosed
CN-106947044-A Polyisocyantates composition, solar cell component lining material, micro-capsule and ink adhesive 三井化学株式会社 2017-07-14 CN disclosed
CN-106032445-A Thermosetting powder coating material and coated product 富士施乐株式会社 2016-10-19 CN disclosed
EP-2468797-A1 PHOTOCURABLE COMPOSITION Bridgestone Corporation (JP) 2012-06-27 EP disclosed
CN-101537746-B Heat resistance improver and reversible thermosensitive recording medium RICOH CO LTD 2011-06-01 CN disclosed
CN-101537746-A Heat resistance improver and reversible thermosensitive recording medium RICOH KK 2009-09-23 CN disclosed
EP-2009030-A1 RESIN COMPOSITION AND HEAT-RESISTANT ADHESIVE Otsuka Chemical Co., Ltd. (JP) 2008-12-31 EP disclosed
WO-2006038735-A1 RESIN COMPOSITION FOR OPTICAL PACKAGING MATERIAL AND PROCESS FOR PREPARING THE SAME, AND OPTICAL PACKAGING MATERIAL, OPTICAL PACKAGING COMPONENT, AND OPTICAL MODULE NIPPON SHOKUBAI CO., LTD. (JP) 2006-04-13 WO disclosed
WO-2004044019-A1 WATER- AND OIL-REPELLENT COATING FILMS KANTO DENKA KOGYO CO., LTD. (JP) 2004-05-27 WO disclosed
EP-0281991-B1 VINYL ETHERS AND FLUORINE-CONTAINING COPOLYMERS PREPARED THEREFROM DAIKIN INDUSTRIES, LIMITED (JP) 1993-07-14 EP disclosed
US-4952653-A POLYMERIZING A FLUOROOLEFIN, A NEUTRALIZED ACID-CONTAINING, ESTER-CONTAINING VINYL ETHER AND AN ACID-CONTAINING, ESTER-CONTAINING VINYL ETHER; STOICHIOMETRY DAIKIN INDUSTRIES, LTD. (JP) 1990-08-28 US disclosed
EP-0338498-A2 Process for preparing fluorine-containing copolymers DAIKIN INDUSTRIES, LIMITED (JP) 1989-10-25 EP disclosed
EP-0281991-A2 Vinyl ethers and fluorine-containing copolymers prepared therefrom DAIKIN INDUSTRIES, LIMITED (JP) 1988-09-14 EP disclosed