SCHEMBL4795111

SCHEMBL4795111

CC(=CCCCOP(=O)(O)OCCCC=C(C)C(=O)O)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
LPAR3 Q9UBY5 4/20 0.39
P2RY10 O00398 5/20 0.36
GGPS1 O95749 2/20 0.35
LPAR2 Q9HBW0 3/20 0.34
LPAR1 Q92633 2/20 0.34
GPR34 Q9UPC5 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4794626 0.95 P2RY10 (0.41) LPAR3P2RY10GGPS1LPAR2LPAR1
SCHEMBL1872112 0.89 LPAR3 (0.50) LPAR3LPAR2LPAR1
SCHEMBL1138196 0.89 P2RY10 (0.35) P2RY10GGPS1GPR34
SCHEMBL1874948 0.84 LPAR3 (0.51) LPAR3LPAR2LPAR1
SCHEMBL27233119 0.83 LPAR3 (0.54) LPAR3LPAR2LPAR1
SCHEMBL1139630 0.81 CYP3A4 (0.41) LPAR3P2RY10LPAR2LPAR1GPR34
SCHEMBL3428266 0.81 ALDH1A1 (0.42)
SCHEMBL493110 0.81 ALDH1A1 (0.42)
SCHEMBL830452 0.79 BTN3A1 (0.50) GGPS1
SCHEMBL721089 0.78 LPAR3 (0.41) LPAR3LPAR2LPAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1201368-B1 Polishing pad comprising a water-insoluble substance and method for producing thereof JSR CORP (JP) 2008-01-16 EP disclosed
US-20040224611-A1 Polishing pad and method of polishing a semiconductor wafer JSR CORPORATION (JP) 2004-11-11 US disclosed
US-6645264-B2 Crosslinkable elastomer with no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups, and a water-insoluble substance with >1 carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups JSR CORPORATION (JP) 2003-11-11 US disclosed
US-20020078632-A1 Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof JSR CORPORATION (JP) 2002-06-27 US disclosed
EP-1201368-A2 Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof JSR Corporation (JP) 2002-05-02 EP disclosed