SCHEMBL4801312

SCHEMBL4801312

C=C(C(=O)O)C(c1ccccc1)S(=O)(=O)c1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
SRC P12931 2/20 0.47
HSD11B1 P28845 1/20 0.41
HPGD P15428 1/20 0.41
MMP1 P03956 1/20 0.39
MMP9 P14780 1/20 0.39
MMP13 P45452 1/20 0.39
ADAM17 P78536 1/20 0.39
TSHR P16473 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
CYP2C19 P33261 2/20 0.37
CYP2D6 P10635 1/20 0.36
ALDH1A1 P00352 1/20 0.36
HTR6 P50406 1/20 0.35
KMT2A Q03164 1/20 0.35
LMNA P02545 2/20 0.35
MAPK1 P28482 1/20 0.35
CTSD P07339 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8812674 0.81 SRC (0.66) SRCHPGDCYP2C19CYP2D6ALDH1A1
SCHEMBL11092157 0.81 SRC (0.64) SRCHSD11B1MMP1MMP9MMP13
SCHEMBL4256204 0.80 SRC (0.48) SRCHPGDSMN1; SMN2CYP2C19CYP2D6
SCHEMBL8451353 0.78 SRC (0.50) SRCHSD11B1MMP1MMP9MMP13
SCHEMBL20582610 0.78 SRC (0.50) SRCHSD11B1HPGDMMP1MMP9
SCHEMBL162823 0.71 HPGD (0.47) SRCHPGDSMN1; SMN2CYP2D6ALDH1A1
SCHEMBL4263145 0.70 CA12 (0.47) SRCHPGDCYP2C19ALDH1A1KMT2A
SCHEMBL7821908 0.70 SRC (0.55) SRCMMP1MMP9MMP13ADAM17
SCHEMBL20582650 0.70 POLB (0.45) SRCHSD11B1MMP1MMP9MMP13
SCHEMBL20582651 0.70 POLB (0.45) SRCHSD11B1MMP1MMP9MMP13

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed