Ethylamine

Ethylamine

SCHEMBL48047

CCN.FB(F)F

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylamine SCHEMBL28225278 0.95
Ethylamine SCHEMBL28351216 0.95
Ethylamine SCHEMBL28049996 0.95
Ethylamine SCHEMBL28330319 0.95
Ethylamine SCHEMBL28242175 0.91
Ethylamine SCHEMBL7094676 0.82 DNM1 (0.30)
Ethylamine SCHEMBL11705226 0.82 DNM1 (0.30)
Propylamine SCHEMBL6305385 0.82
Ethylamine SCHEMBL4363313 0.82 DNM1 (0.30)
Ethylamine SCHEMBL6328365 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4639 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122037458-A High-transparency epoxy glass fiber dry-method prepreg composite material and preparation method thereof 浙江兆奕科技有限公司 2026-05-15 CN claimed
CN-116731289-B Epoxy resin composition and high-heat-resistance high-strength high-toughness epoxy prepreg 上海华谊树脂有限公司 2026-05-15 CN claimed
CN-122051205-A Boron-doped porous carbon gas-phase silicon-carbon composite anode material and preparation method thereof 西北工业大学 2026-05-15 CN claimed
US-20260132550-A1 CARBON FIBER BUNDLE, AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL USING SAME TORAY INDUSTRIES, INC. (JP) 2026-05-14 US claimed
EP-4726102-A1 SIZING AGENT-CONTAINING CARBON FIBER BUNDLE, CARBON FIBER-REINFORCED COMPOSITE MATERIAL, AND PRESSURE CONTAINER Toray Industries, Inc. (JP) 2026-04-15 EP claimed
CN-119979092-B Composite ultrathin bonding sheet for multilayer lamination of high-frequency copper-clad plate and preparation method thereof 广东盈华电子材料有限公司 2026-02-27 CN claimed
EP-4636005-A1 RAW MATERIAL COMPOSITION FOR CHROMATOGRAPHY MATERIAL, CHROMATOGRAPHY MATERIAL, PREPARATION METHOD THEREFOR AND USE THEREOF, MONOLITHIC COLUMN, AND CHROMATOPILE Yu Ji (Shanghai) Biological Technology Co., Ltd. (CN) 2025-10-22 EP claimed
EP-4632863-A1 USE OF PYROSULFATE-BORON TRIFLUORIDE COMPOSITE METAL SALT IN ELECTROLYTE SOLUTION, AND PREPARATION METHOD THEREFOR Zhejiang Lantian Environmental Protection Hi-Tech Co., Ltd. (CN) 2025-10-15 EP claimed
US-20250300230-A1 USE OF PYROSULFATE-BORON TRIFLUORIDE COMPOSITE METAL SALT IN ELECTROLYTE SOLUTION, AND PREPARATION METHOD THEREFOR ZHEJIANG LANTIAN ENVIRONMENTAL PROTECTION HI-TECH CO., LTD. (CN) 2025-09-25 US claimed
CN-120192632-A Epoxy resin composition, method for producing the same, and electrical insulation 麦克奥迪(厦门)智能电气有限公司 2025-06-24 CN claimed
US-4609686-A IN SITU COPOLYMERIZATION THE STANDARD OIL COMPANY (US) 1986-09-02 US claimed
US-4605570-A WEAR REISITANCE ARMSTRONG WORLD INDUSTRIES, INC. (US) 1986-08-12 US claimed
EP-0189631-A1 Methods and compositions for removal of moisture EPOXY TECHNOLOGY, INC. (US) 1986-08-06 EP claimed
US-4532047-A Inhibiting amorphous silica scale formation by treating water with water soluble polypolar organic compound containing hydroxyl and/or primary amine groups NALCO CHEMICAL COMPANY (US) 1985-07-30 US claimed
US-4448940-A POLYOXAZOLINES BASED ON DINITRILES AND DIEPOXY COMPOUNDS; POLYISOCYANURATE; FLEXIBILITY; PRINTED CIRCUITS HITACHI, LTD. (JP) 1984-05-15 US claimed
US-4427740-A COVERING A CONDUCTIVE MEMBER WITH POROUS CYCLOALIPHATIC EPOXY RESIN, SILICON CARBIDE AND CURING AGENT, VACUUM PRESSURE IMPREGNATION WITH RESIN, AND HEATING WESTINGHOUSE ELECTRIC CORP. (US) 1984-01-24 US claimed
US-4292396-A Method for improving the press life of a lithographic image having an outer layer comprising an epoxy resin and article produced by method WESTERN LITHO PLATE & SUPPLY CO. (US) 1981-09-29 US claimed
US-4247594-A CURING A MIXTURE OF COPPER FLAKES, THE DIGLYCIDYL ETHER OF BISPHENOL A, AND A CURING AGENT AND THEN APPLYING AN ELECTRICAL POTENTIAL MARSHALL & PIKE ENTERPRISES INC. (US) 1981-01-27 US claimed
US-4214026-A PHOTOPOLYMERIZABLE RESIN ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1980-07-22 US claimed
US-4021410-A Melt-spun drawn or undrawn flame-resistant and antifusing cured epoxy-modified novolak filaments and process for production thereof NIPPON KYNOL INC. (JA) 1977-05-03 US claimed