SCHEMBL4808076

SCHEMBL4808076

CO[Si](CCCOCC1CO1)(C(C)C)C(C)C

nearest known ligand 0.53

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.53
SMN1; SMN2 Q16637 1/20 0.51
ALDH1A1 P00352 4/20 0.49
TDP1 Q9NUW8 1/20 0.49
MAPK1 P28482 1/20 0.37
TP53 P04637 1/20 0.30
CYP3A4 P08684 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17530121 0.86 TSHR (0.49) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL17530122 0.85 TSHR (0.47) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL676483 0.84 SMN1; SMN2 (0.53) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL4810575 0.84 TSHR (0.53) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL19511186 0.81 TSHR (0.59) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL15429247 0.81 TSHR (0.59) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL4809801 0.81 TSHR (0.46) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL28087417 0.81 ALDH1A1 (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL3131451 0.80 SMN1; SMN2 (0.47) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL125938 0.80 TSHR (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117480273-A Primer composition for vapor deposition of inorganic oxide, cured product, and laminate DIC株式会社 2024-01-30 CN disclosed
WO-2023171514-A1 LAMINATE AND PACKAGING MATERIAL DIC株式会社 2023-09-14 WO disclosed
WO-2022264906-A1 PRIMER COMPOSITION FOR INORGANIC OXIDE VAPOR DEPOSITION, CURED PRODUCT AND MULTILAYER BODY DIC株式会社 2022-12-22 WO disclosed
EP-2990433-B1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DAINIPPON INK & CHEMICALS (JP) 2022-03-09 EP disclosed
WO-2020066993-A1 COMPOSITION, CURED OBJECT, LAMINATE, AND LIGHT RESISTANT COATING MATERIAL DIC株式会社 2020-04-02 WO disclosed
EP-3213915-B1 LAMINATE DAINIPPON INK & CHEMICALS (JP) 2019-08-14 EP disclosed
US-20170253965-A1 LAMINATE DIC CORPORATION (JP) 2017-09-07 US disclosed
EP-3213915-A1 LAMINATE DIC Corporation (JP) 2017-09-06 EP disclosed
US-20160137879-A1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DIC CORPORATION (JP) 2016-05-19 US disclosed
EP-2990433-A1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DIC Corporation (JP) 2016-03-02 EP disclosed
US-20140061970-A1 NANOIMPRINT CURABLE COMPOSITION, NANOIMPRINT-LITHOGRAPHIC MOLDED PRODUCT, AND METHOD FOR FORMING PATTERN DIC CORPORATION (JP) 2014-03-06 US disclosed
US-7435668-B2 Method for doping impurities, and for producing a semiconductor device and applied electronic apparatus using a solution containing impurity ions SONY CORPORATION (JP) 2008-10-14 US disclosed
US-7335539-B2 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2008-02-26 US disclosed
US-20070298550-A1 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2007-12-27 US disclosed
US-7273774-B2 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2007-09-25 US disclosed
US-20060079033-A1 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2006-04-13 US disclosed
US-6953754-B2 Functional device and method of manufacturing the same SONY CORPORATION (JP) 2005-10-11 US disclosed
US-20050181566-A1 Method for doping impurities, methods for producing semiconductor device and applied electronic apparatus SONY CORPORATION (JP) 2005-08-18 US disclosed
US-20040157470-A1 Functional device and production method therefor SONY CORPORATION (JP) 2004-08-12 US disclosed