SCHEMBL4810041

SCHEMBL4810041

CCO[Si](CCC1CCC2OC2C1)(OC)C(C)C

nearest known ligand 0.30

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.30
PTGS2 P35354 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4810271 0.93
SCHEMBL6423339 0.84
SCHEMBL4807500 0.82
SCHEMBL28089789 0.81 PTGS1 (0.30) PTGS1PTGS2
SCHEMBL6423477 0.81 PTGS1 (0.31) PTGS1PTGS2
SCHEMBL6424775 0.80 PTGS1 (0.32) PTGS1PTGS2
SCHEMBL3294819 0.80 PTGS1 (0.32) PTGS1PTGS2
SCHEMBL3300369 0.80 PTGS1 (0.32) PTGS1PTGS2
SCHEMBL6755355 0.79 PTGS1 (0.32) PTGS1PTGS2
SCHEMBL845272 0.79 PTGS1 (0.30) PTGS1PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023171514-A1 LAMINATE AND PACKAGING MATERIAL DIC株式会社 2023-09-14 WO disclosed
EP-2990433-B1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DAINIPPON INK & CHEMICALS (JP) 2022-03-09 EP disclosed
EP-3213915-B1 LAMINATE DAINIPPON INK & CHEMICALS (JP) 2019-08-14 EP disclosed
US-20170253965-A1 LAMINATE DIC CORPORATION (JP) 2017-09-07 US disclosed
EP-3213915-A1 LAMINATE DIC Corporation (JP) 2017-09-06 EP disclosed
US-20160137879-A1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DIC CORPORATION (JP) 2016-05-19 US disclosed
EP-2990433-A1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DIC Corporation (JP) 2016-03-02 EP disclosed
CN-105339418-A Inorganic microparticle composite, method for producing same, composition, and cured product DAINIPPON INK &AMP 2016-02-17 CN disclosed
US-20140061970-A1 NANOIMPRINT CURABLE COMPOSITION, NANOIMPRINT-LITHOGRAPHIC MOLDED PRODUCT, AND METHOD FOR FORMING PATTERN DIC CORPORATION (JP) 2014-03-06 US disclosed
US-7435668-B2 Method for doping impurities, and for producing a semiconductor device and applied electronic apparatus using a solution containing impurity ions SONY CORPORATION (JP) 2008-10-14 US disclosed
US-7335539-B2 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2008-02-26 US disclosed
US-20070298550-A1 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2007-12-27 US disclosed
US-7273774-B2 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2007-09-25 US disclosed
US-20060079033-A1 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2006-04-13 US disclosed
US-6953754-B2 Functional device and method of manufacturing the same SONY CORPORATION (JP) 2005-10-11 US disclosed
US-20050181566-A1 Method for doping impurities, methods for producing semiconductor device and applied electronic apparatus SONY CORPORATION (JP) 2005-08-18 US disclosed
US-20040157470-A1 Functional device and production method therefor SONY CORPORATION (JP) 2004-08-12 US disclosed