⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4810041 | 0.93 | PTGS1 (0.30) | — | |
| SCHEMBL6423339 | 0.87 | — | — | |
| SCHEMBL4807500 | 0.85 | — | — | |
| SCHEMBL845272 | 0.82 | PTGS1 (0.30) | — | |
| SCHEMBL23061486 | 0.81 | PTGS1 (0.32) | — | |
| SCHEMBL20478203 | 0.81 | PTGS1 (0.32) | — | |
| SCHEMBL48916 | 0.81 | PTGS1 (0.32) | — | |
| SCHEMBL20658050 | 0.81 | PTGS1 (0.32) | — | |
| SCHEMBL286926 | 0.81 | PTGS1 (0.32) | — | |
| SCHEMBL611497 | 0.81 | PTGS1 (0.34) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117480273-A | Primer composition for vapor deposition of inorganic oxide, cured product, and laminate | DIC株式会社 | 2024-01-30 | — | — | CN | disclosed |
| WO-2023171514-A1 | LAMINATE AND PACKAGING MATERIAL | DIC株式会社 | 2023-09-14 | — | — | WO | disclosed |
| WO-2022264906-A1 | PRIMER COMPOSITION FOR INORGANIC OXIDE VAPOR DEPOSITION, CURED PRODUCT AND MULTILAYER BODY | DIC株式会社 | 2022-12-22 | — | — | WO | disclosed |
| WO-2020066993-A1 | COMPOSITION, CURED OBJECT, LAMINATE, AND LIGHT RESISTANT COATING MATERIAL | DIC株式会社 | 2020-04-02 | — | — | WO | disclosed |
| EP-3213915-B1 | LAMINATE | DAINIPPON INK & CHEMICALS (JP) | 2019-08-14 | — | — | EP | disclosed |
| US-20170253965-A1 | LAMINATE | DIC CORPORATION (JP) | 2017-09-07 | — | — | US | disclosed |
| EP-3213915-A1 | LAMINATE | DIC Corporation (JP) | 2017-09-06 | — | — | EP | disclosed |
| CN-106104753-A | The duplexer of oxygen plasma etch erosion resistant, etchant resist and use etchant resist | DIC株式会社 | 2016-11-09 | — | — | CN | disclosed |
| CN-103392221-B | Curing combination for nanometer stamping, nano impression formed body and pattern formation method | DIC株式会社 | 2016-08-10 | — | — | CN | disclosed |
| US-20160137879-A1 | INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT | DIC CORPORATION (JP) | 2016-05-19 | — | — | US | disclosed |
| CN-105339418-A | Inorganic microparticle composite, method for producing same, composition, and cured product | DAINIPPON INK & | 2016-02-17 | — | — | CN | disclosed |
| US-20140061970-A1 | NANOIMPRINT CURABLE COMPOSITION, NANOIMPRINT-LITHOGRAPHIC MOLDED PRODUCT, AND METHOD FOR FORMING PATTERN | DIC CORPORATION (JP) | 2014-03-06 | — | — | US | disclosed |
| US-7435668-B2 | Method for doping impurities, and for producing a semiconductor device and applied electronic apparatus using a solution containing impurity ions | SONY CORPORATION (JP) | 2008-10-14 | — | — | US | disclosed |
| US-7335539-B2 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2008-02-26 | — | — | US | disclosed |
| US-20070298550-A1 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2007-12-27 | — | — | US | disclosed |
| US-7273774-B2 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2007-09-25 | — | — | US | disclosed |
| US-20060079033-A1 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2006-04-13 | — | — | US | disclosed |
| US-6953754-B2 | Functional device and method of manufacturing the same | SONY CORPORATION (JP) | 2005-10-11 | — | — | US | disclosed |
| US-20050181566-A1 | Method for doping impurities, methods for producing semiconductor device and applied electronic apparatus | SONY CORPORATION (JP) | 2005-08-18 | — | — | US | disclosed |
| US-20040157470-A1 | Functional device and production method therefor | SONY CORPORATION (JP) | 2004-08-12 | — | — | US | disclosed |