SCHEMBL4811047

SCHEMBL4811047

CCCCCCCCCCCCCCCCC(Cc1ccc(C(Br)Br)cc1)C(=O)O

nearest known ligand 0.47

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ FOLH1 Q04609 2/20 0.47
▸ LCK P06239 1/20 0.46
▸ PPARD Q03181 1/20 0.46
▸ ZDHHC20 Q5W0Z9 1/20 0.46
▸ ZDHHC2 Q9UIJ5 1/20 0.46
▸ PTGES O14684 3/20 0.45
▸ ALOX5 P09917 3/20 0.45
▸ PPARG P37231 3/20 0.45
▸ PPARA Q07869 1/20 0.45
▸ GRIK1 P39086 2/20 0.44
▸ GRIK2 Q13002 2/20 0.44
▸ SLC1A2 P43004 1/20 0.42
▸ SLC1A1 P43005 1/20 0.42
▸ CPA3 P15088 1/20 0.42
▸ MMP2 P08253 8/20 0.42
▸ MMP1 P03956 3/20 0.42
▸ MMP3 P08254 3/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28807898 0.87 FOLH1 (0.48) FOLH1PTGESALOX5PPARGPPARA
SCHEMBL8556131 0.85 MME (0.56) FOLH1LCKPPARDZDHHC20ZDHHC2
SCHEMBL5326614 0.84 ESR1 (0.50) FOLH1LCKPTGESALOX5PPARG
SCHEMBL7768894 0.84 PTGES (0.50) FOLH1PTGESALOX5PPARGPPARA
SCHEMBL28223654 0.84 PTGES (0.50) FOLH1PTGESALOX5PPARGPPARA
SCHEMBL9209348 0.83 FOLH1 (0.66) FOLH1PTGESALOX5PPARGCPA3
SCHEMBL9653477 0.83 FOLH1 (0.66) FOLH1PTGESALOX5PPARGCPA3
SCHEMBL10960336 0.83 FOLH1 (0.66) FOLH1PTGESALOX5PPARGCPA3
SCHEMBL5179711 0.83 FOLH1 (0.66) FOLH1PTGESALOX5PPARGCPA3
SCHEMBL10955140 0.83 FOLH1 (0.66) FOLH1PTGESALOX5PPARGCPA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111375928-A Flux for jet welding and welding method 荒川化学工业株式会社 2020-07-07 — — CN disclosed
US-9314879-B2 Lead-free solder flux and lead-free solder paste ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2016-04-19 — — US disclosed
EP-2851396-A1 BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE Arakawa Chemical Industries, Ltd. (JP) 2015-03-25 — — EP disclosed
US-20150075676-A1 BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2015-03-19 — — US disclosed
US-20130276937-A1 LEAD-FREE SOLDER FLUX AND LEAD-FREE SOLDER PASTE ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2013-10-24 — — US disclosed
US-7357291-B2 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2008-04-15 — — US disclosed
US-20060071051-A1 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2006-04-06 — — US disclosed
US-6881278-B2 Flux for solder paste SHOWA DENKO K.K. (JP) 2005-04-19 — — US disclosed
US-20030200836-A1 Flux for solder paste SHOWA DENKO K.K. 2003-10-30 — — US disclosed
WO-2003064102-A1 SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE SHOWA DENKO K.K. (JP) 2003-08-07 — — WO disclosed
US-20020046627-A1 Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product SHOWA DENKO K.K. (JP) 2002-04-25 — — US disclosed
US-20010042779-A1 Solder paste SHOWA DENKO KABUSHIKI KAISHA (JP) 2001-11-22 — — US disclosed
Send feedback