SCHEMBL4812801

SCHEMBL4812801

C=CC(O)N(O)C(O)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30983 0.74
SCHEMBL8161711 0.74
SCHEMBL5327502 0.71
SCHEMBL11663807 0.69
SCHEMBL3409575 0.69
SCHEMBL5141358 0.69
SCHEMBL5704883 0.69
SCHEMBL1497604 0.67
SCHEMBL9001345 0.65
SCHEMBL1615328 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008135680-A2 USE OF HYDROXYLAMINES AS AGENTS FOR DESTROYING HYDROPHILIC POLYMER AND CORRESPONDING METHOD FOR DESTROYING SUCH POLYMERS ARKEMA FRANCE (FR) 2008-11-13 WO claimed
US-11385548-B2 Process liquid and method of processing substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-12 US disclosed
US-20200241424-A1 PROCESS LIQUID AND METHOD OF PROCESSING SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-07-30 US disclosed
EP-2475000-B1 PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME WAKO PURE CHEM IND LTD (JP) 2015-07-01 EP disclosed
US-9034810-B2 Processing agent composition for semiconductor surface and method for processing semiconductor surface using same WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-05-19 US disclosed
US-9006164-B2 Resist remover composition and method for removing resist using the composition WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-04-14 US disclosed
EP-2474862-B1 COMPOSITION FOR REMOVING A RESIST ON A SEMICONDUCTOR SUBSTRATE AND METHOD FOR REMOVING RESIST USING THE COMPOSITION WAKO PURE CHEM IND LTD (JP) 2015-02-25 EP disclosed
EP-2475000-A1 PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME Wako Pure Chemical Industries, Ltd. (JP) 2012-07-11 EP disclosed
EP-2474862-A1 RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION Wako Pure Chemical Industries, Ltd. (JP) 2012-07-11 EP disclosed
US-20120172274-A1 RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2012-07-05 US disclosed
US-20120157368-A1 PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2012-06-21 US disclosed
WO-2008135680-A2 USE OF HYDROXYLAMINES AS AGENTS FOR DESTROYING HYDROPHILIC POLYMER AND CORRESPONDING METHOD FOR DESTROYING SUCH POLYMERS ARKEMA FRANCE (FR) 2008-11-13 WO disclosed