SCHEMBL4815438

SCHEMBL4815438

CCCC(N)O[SiH](C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4815376 0.80
SCHEMBL4812174 0.77
SCHEMBL5804433 0.73 OPRM1 (0.31)
SCHEMBL4997405 0.71 OPRM1 (0.35)
SCHEMBL30175004 0.70
SCHEMBL4820807 0.70
SCHEMBL310077 0.69
SCHEMBL22535876 0.69
SCHEMBL2155565 0.69
SCHEMBL1396264 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7387832-B2 Flat particles and process for production thereof NISSHINBO INDUSTRIES, INC. (JP) 2008-06-17 US disclosed
EP-1828285-A1 ORGANOPOLYSILOXANE POLYUREA COPOLYMERS Wacker Chemie AG (DE) 2007-09-05 EP disclosed
US-7258921-B2 Composite particle with a carbodiimide resin layer and a process for producing the same NISSHINBO INDUSTRIES, INC. (JP) 2007-08-21 US disclosed
WO-2006069639-A1 ORGANOPOLYSILOXANE POLYUREA COPOLYMERS WACKER CHEMIE AG (DE) 2006-07-06 WO disclosed
US-20060052549-A1 Flat particles and process for production thereof NISSHINBO INDUSTRIES, INC. (JP) 2006-03-09 US disclosed
US-20050271875-A1 Composite particle with a carbodimide resin layer and process for producing the same NISSHINBO INDUSTRIES, INC. (JP) 2005-12-08 US disclosed
EP-1553124-A1 FLAKY PARTICLES AND PROCESS FOR PRODUCTION THEREOF Nisshinbo Industries, Inc. (JP) 2005-07-13 EP disclosed
US-20050118424-A1 particles comprising thermoplastic resins impregnated with carbodiimide compounds, having heat and solvent resistance, used as curing agents, stabilizers, hardeners, adhesives, coatings, paints, reinforcements and in automobiles, electronics, furniture, construction materials and as spacers TAKAHASHI IKUO (JP) 2005-06-02 US disclosed
EP-1528077-A1 COMPOSITE PARTICLE HAVING CARBODIIMIDE RESIN LAYER AND PROCESS FOR PRODUCING THE SAME Nisshinbo Industries, Inc. (JP) 2005-05-04 EP disclosed
US-6866934-B2 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction NISSHINBO INDUSTRIES, INC. (JP) 2005-03-15 US disclosed
US-20030215636-A1 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction NISSHINBO INDUSTRIES, INC. (JP) 2003-11-20 US disclosed
EP-1344795-A2 Carbodiimide-containing hardening type reactive particles, process for producing the same, and use of the same NISSHINBO INDUSTRIES, INC. (JP) 2003-09-17 EP disclosed
EP-0648796-B1 Solutions of polyimide-forming substances and their use SCHENECTADY INT INC (US) 1998-08-26 EP disclosed
US-5493003-A MIXTURES OF AMINES, AMIDES AND/OR ESTERS OF TETRACARBOXYLIC ACIDS HAVING AMIDO OR ESTER GROUPS SUBSTITUTED WITH CARBOXYL, SULFO, SILYL OR SILOXY GROUPS, ELECTRONICS BASF LACKE + FARBEN AKTIENGESELLSCHAFT (DE) 1996-02-20 US disclosed
EP-0648796-A1 Solutions of polyimide-forming substances and their use BASF Lacke + Farben AG (DE) 1995-04-19 EP disclosed