⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4809111 | 0.88 | — | — | |
| SCHEMBL4806179 | 0.86 | — | — | |
| SCHEMBL1997386 | 0.81 | PTGS1 (0.30) | — | |
| SCHEMBL4809004 | 0.81 | PTGS1 (0.31) | — | |
| SCHEMBL4807555 | 0.80 | — | — | |
| SCHEMBL1995213 | 0.79 | — | — | |
| SCHEMBL4810055 | 0.78 | — | — | |
| SCHEMBL4824393 | 0.78 | — | — | |
| SCHEMBL4808802 | 0.77 | PTGS1 (0.30) | — | |
| SCHEMBL4810417 | 0.74 | PTGS1 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023171514-A1 | LAMINATE AND PACKAGING MATERIAL | DIC株式会社 | 2023-09-14 | — | — | WO | disclosed |
| WO-2022264906-A1 | PRIMER COMPOSITION FOR INORGANIC OXIDE VAPOR DEPOSITION, CURED PRODUCT AND MULTILAYER BODY | DIC株式会社 | 2022-12-22 | — | — | WO | disclosed |
| EP-3213915-B1 | LAMINATE | DAINIPPON INK & CHEMICALS (JP) | 2019-08-14 | — | — | EP | disclosed |
| US-20170253965-A1 | LAMINATE | DIC CORPORATION (JP) | 2017-09-07 | — | — | US | disclosed |
| EP-3213915-A1 | LAMINATE | DIC Corporation (JP) | 2017-09-06 | — | — | EP | disclosed |
| US-20140061970-A1 | NANOIMPRINT CURABLE COMPOSITION, NANOIMPRINT-LITHOGRAPHIC MOLDED PRODUCT, AND METHOD FOR FORMING PATTERN | DIC CORPORATION (JP) | 2014-03-06 | — | — | US | disclosed |
| US-7335539-B2 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2008-02-26 | — | — | US | disclosed |
| US-20070298550-A1 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2007-12-27 | — | — | US | disclosed |
| US-7273774-B2 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2007-09-25 | — | — | US | disclosed |
| US-20060079033-A1 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2006-04-13 | — | — | US | disclosed |