SCHEMBL4828741

SCHEMBL4828741

CCC1(O)COC(C(C)(C)CO)OC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15856915 0.82 EPHX1 (0.32)
SCHEMBL8571779 0.81 EPHX1 (0.31)
SCHEMBL44322 0.79
SCHEMBL233460 0.79 EPHX1 (0.30)
SCHEMBL5943652 0.78 NPC1 (0.31)
SCHEMBL16659345 0.77 KDM4E (0.33)
SCHEMBL1993294 0.77
SCHEMBL4383381 0.76 EPHX1 (0.33)
SCHEMBL17219539 0.76 EPHX1 (0.30)
SCHEMBL1993292 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108572514-B Photosensitive resin composition, cured product, substrate, and article 日本化药株式会社 2022-08-23 CN disclosed
US-7374862-B2 Photosensitive resin composition and curing product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-05-20 US disclosed
US-20060102051-A1 Photosensitive resin composition and curing product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2006-05-18 US disclosed
EP-1600812-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURING PRODUCT THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2005-11-30 EP disclosed