SCHEMBL4830633

SCHEMBL4830633

[CH2]CCCCCCCC=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4840348 1.00
SCHEMBL4836621 1.00
SCHEMBL1322409 1.00
SCHEMBL4838016 1.00
SCHEMBL4833880 1.00
SCHEMBL3564481 1.00
SCHEMBL4837543 1.00
SCHEMBL4833922 1.00
SCHEMBL2569586 0.97
SCHEMBL726154 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9416318-B2 Liquid crystal composition, polymer, film, and cholesteric liquid crystal FUJIFILM CORPORATION (JP) 2016-08-16 US disclosed
CN-104871046-A Multilayered cholesteric liquid crystal, process for producing same, and laminate of multilayered cholesteric liquid crystal FUJIFILM CORP 2015-08-26 CN disclosed
US-20150152332-A1 LIQUID CRYSTAL COMPOSITION, POLYMER, FILM, AND CHOLESTERIC LIQUID CRYSTAL FUJIFILM CORPORATION (JP) 2015-06-04 US disclosed
CN-1800981-B Photosensitive resin composition, thin film panel made with photosensitive composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD 2010-12-01 CN disclosed
US-7338737-B2 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-04 US disclosed
CN-100357300-C Isooctanoic acid mercapto alcohol ester based organic tin compound and its preparation method and use UNIV SOUTH CHINA TECH (CN) 2007-12-26 CN disclosed
US-7297452-B2 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-20070254221-A1 Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. SAMSUNG DISPLAY CO., LTD. (KR) 2007-11-01 US disclosed
CN-1808273-A Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD (KR) 2006-07-26 CN disclosed
CN-1800981-A Photosensitive resin composition, thin film panel made with photosensitive composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD (KR) 2006-07-12 CN disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed