SCHEMBL4836880

SCHEMBL4836880

[Al].[Hf].[O]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5013176 0.87
SCHEMBL5013345 0.82
SCHEMBL7592458 0.82
SCHEMBL30642063 0.82
SCHEMBL6037221 0.82
SCHEMBL3841426 0.82
SCHEMBL491101 0.82
SCHEMBL2709871 0.67
Fluoride SCHEMBL10010956 0.67
SCHEMBL3188217 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113437049-B Hafnium-based ferroelectric memory and preparation method thereof 复旦大学 2022-10-11 CN claimed
CN-111668023-B Preparation method and application of hafnium-aluminum-oxygen film 肇庆市华师大光电产业研究院 2021-10-08 CN claimed
CN-113437049-A Hafnium-based ferroelectric memory and preparation method thereof 复旦大学 2021-09-24 CN claimed
CN-111668023-A Preparation method of hafnium-aluminum-oxygen thin film with excellent electrical property and application of hafnium-aluminum-oxygen thin film in preparation of radio frequency thin film capacitor 肇庆市华师大光电产业研究院 2020-09-15 CN claimed
US-7326984-B2 MIS capacitor and method of formation MICRON TECHNOLOGY, INC (US) 2008-02-05 US claimed
US-20070138529-A1 MIS capacitor and method of formation ROUND ROCK RESEARCH, LLC 2007-06-21 US claimed
US-7164165-B2 MIS capacitor MICRON TECHNOLOGY, INC. (US) 2007-01-16 US claimed
US-20060244027-A1 MIS capacitor and method of formation ROUND ROCK RESEARCH, LLC 2006-11-02 US claimed
US-20060128108-A1 Method for forming a titanium nitride layer and method for forming a lower electrode of a MIM capacitor using the titanium nitride layer SAMSUNG ELECTRONICS CO., LTD. 2006-06-15 US claimed
US-7029985-B2 Method of forming MIS capacitor MICRON TECHNOLOGY, INC. (US) 2006-04-18 US claimed
US-6753618-B2 MIM capacitor with metal nitride electrode materials and method of formation MICRON TECHNOLOGY, INC. 2004-06-22 US claimed
US-20040046197-A1 MIS capacitor and method of formation ROUND ROCK RESEARCH, LLC 2004-03-11 US claimed
US-20030213987-A1 MIS capacitor and method of formation ROUND ROCK RESEARCH, LLC 2003-11-20 US claimed
US-20030205729-A1 MIM capacitor with metal nitride electrode materials and method of formation ROUND ROCK RESEARCH, LLC 2003-11-06 US claimed
WO-2003079417-A2 MIM CAPACITOR WITH METAL NITRIDE ELECTRODE MATERIALS AND METHOD OF FORMATION MICRON TECHNOLOGY, INC. (US) 2003-09-25 WO claimed
US-20030168750-A1 MIM capacitor with metal nitride electrode materials and method of formation ROUND ROCK RESEARCH, LLC 2003-09-11 US claimed
CN-118299245-A Monolithic modular high frequency plasma source 应用材料公司 2024-07-05 CN disclosed
CN-114424318-B Monolithic modular high frequency plasma source 应用材料公司 2024-03-12 CN disclosed
WO-2003079417-A2 MIM CAPACITOR WITH METAL NITRIDE ELECTRODE MATERIALS AND METHOD OF FORMATION MICRON TECHNOLOGY, INC. (US) 2003-09-25 WO disclosed
US-20030168750-A1 MIM capacitor with metal nitride electrode materials and method of formation ROUND ROCK RESEARCH, LLC 2003-09-11 US disclosed