SCHEMBL4839751

SCHEMBL4839751

CCCCCOCCOCCOC(C)CC

nearest known ligand 0.55

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.48
MEN1 O00255 1/20 0.48
THRB P10828 1/20 0.48
KMT2A Q03164 1/20 0.48
MAPT P10636 1/20 0.48
USP2 O75604 1/20 0.38
TSHR P16473 2/20 0.38
SPHK1 Q9NYA1 1/20 0.38
CYP3A4 P08684 1/20 0.38
CES2 O00748 1/20 0.36
DNM1 Q05193 1/20 0.36
LPAR1 Q92633 4/20 0.35
LPAR3 Q9UBY5 4/20 0.35
LPAR2 Q9HBW0 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27905294 1.00 HTT (0.48) HTTMEN1THRBKMT2AMAPT
SCHEMBL28774505 0.98 HTT (0.52) HTTMEN1THRBKMT2AMAPT
SCHEMBL4834938 0.93 TSHR (0.44) HTTMEN1THRBKMT2AMAPT
SCHEMBL289283 0.93 TSHR (0.44) HTTMEN1THRBKMT2AMAPT
SCHEMBL8400590 0.86 DNM1 (0.46) HTTMEN1THRBKMT2AMAPT
SCHEMBL1476547 0.86 TDP1 (0.33)
SCHEMBL1476765 0.86 TDP1 (0.33)
SCHEMBL16615910 0.84 TDP1 (0.41) HTTMEN1THRBKMT2AMAPT
SCHEMBL12978500 0.84 DNM1 (0.50) HTTMEN1THRBKMT2AMAPT
SCHEMBL19822054 0.84 DNM1 (0.50) HTTMEN1THRBKMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102898149-A Solvent or solvent composition for manufacturing laminated ceramic member DAICEL CHEM 2013-01-30 CN disclosed
CN-102731112-A Solvent or solvent composition for producing laminated ceramic component DAICEL FINECHEM LTD 2012-10-17 CN disclosed
CN-1760757-B Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO 2010-11-10 CN disclosed
CN-1760758-B Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO 2010-11-03 CN disclosed
US-7338737-B2 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-04 US disclosed
US-7297452-B2 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-20070254221-A1 Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. SAMSUNG DISPLAY CO., LTD. (KR) 2007-11-01 US disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed
CN-1760758-A Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO (JP) 2006-04-19 CN disclosed
CN-1760757-A Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO (JP) 2006-04-19 CN disclosed