Di(Hydroxyethyl)Ether

Di(Hydroxyethyl)Ether

SCHEMBL4840428

CCCOC(C)C.OCCOCCO

nearest known ligand 0.52

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Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.52
MAPK1 P28482 2/20 0.48
MEN1 O00255 3/20 0.46
KMT2A Q03164 3/20 0.46
THRB P10828 1/20 0.46
HTT P42858 1/20 0.46
MAPT P10636 1/20 0.46
ALDH1A1 P00352 2/20 0.46
HSD17B10 Q99714 1/20 0.39
TDP1 Q9NUW8 1/20 0.38
USP2 O75604 2/20 0.32
LMNA P02545 1/20 0.32
CYP3A4 P08684 1/20 0.32
CASP1 P29466 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
SLCO1B3 Q9NPD5 1/20 0.32
SLCO1B1 Q9Y6L6 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28890321 0.95 TSHR (0.46) TSHRMAPK1MEN1KMT2ATHRB
Ether SCHEMBL8528759 0.92 ALDH1A1 (0.50) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL8585424 0.91 MEN1 (0.48) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL29232128 0.91 MEN1 (0.48) TSHRMAPK1MEN1KMT2ATHRB
Butoxyethanol SCHEMBL8584938 0.89 TSHR (0.71) TSHRMAPK1MEN1KMT2ATHRB
Ethylene Glycol SCHEMBL27888510 0.87 HSD17B10 (0.39) TSHRMEN1KMT2ATHRBHTT
Di(Hydroxyethyl)Ether SCHEMBL4838934 0.86 TSHR (0.67) TSHRMAPK1MEN1KMT2ATHRB
Butoxyethanol SCHEMBL28059776 0.86 TSHR (0.65) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL9640229 0.85 MEN1 (0.58) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL9639782 0.85 MEN1 (0.58) TSHRMAPK1MEN1KMT2ATHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102898149-A Solvent or solvent composition for manufacturing laminated ceramic member DAICEL CHEM 2013-01-30 CN disclosed
CN-102731112-A Solvent or solvent composition for producing laminated ceramic component DAICEL FINECHEM LTD 2012-10-17 CN disclosed
US-7338737-B2 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-04 US disclosed
US-7297452-B2 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-20070254221-A1 Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. SAMSUNG DISPLAY CO., LTD. (KR) 2007-11-01 US disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed