SCHEMBL4856069

SCHEMBL4856069

C1=CC2CCC1C2.OF

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2701619 1.00
SCHEMBL36991 0.89
SCHEMBL22129636 0.89
SCHEMBL6065835 0.89
SCHEMBL11183068 0.89
Methyl Alcohol SCHEMBL680896 0.86
Charcoal, Activated SCHEMBL9015473 0.85
SCHEMBL31273742 0.85
SCHEMBL10345890 0.85
Potassium SCHEMBL31207301 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7351521-B2 Photoresist composition for deep ultraviolet lithography AZ ELECTRONIC MATERIALS USA CORP. (US) 2008-04-01 US disclosed
US-20070172762-A1 Photoresist composition for deep ultraviolet lithography DAMMEL RALPH R 2007-07-26 US disclosed
US-20070154841-A1 Photoresist composition for deep ultraviolet lithography AZ ELECTRONIC MATERIALS USA CORP. 2007-07-05 US disclosed
US-7211366-B2 Photoresist composition for deep ultraviolet lithography AZ ELECTRONIC MATERIALS USA CORP. (US) 2007-05-01 US disclosed
EP-1602011-A2 PHOTORESIST COMPOSITION FOR DEEP ULTRAVIOLET LITHOGRAPHY AZ Electronic Materials USA Corp. (US) 2005-12-07 EP disclosed
US-6884564-B2 Fluorinated polymers having ester groups and photoresists for microlithography E. I. DU PONT DE NEMOURS AND COMPANY (US) 2005-04-26 US disclosed
US-20040180287-A1 Fluorinated polymers having ester groups and photoresists for microlithography E.I. DU PONT DE NEMOURS AND COMPANY 2004-09-16 US disclosed
WO-2004074928-A2 PHOTORESIST COMPOSITION FOR DEEP ULTRAVIOLET LITHOGRAPHY AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-09-02 WO disclosed
US-20040166434-A1 Photoresist composition for deep ultraviolet lithography AZ ELECTRONIC MATERIALS USA CORP. 2004-08-26 US disclosed
US-20040166433-A1 Photoresist composition for deep ultraviolet lithography AZ ELECTRONIC MATERIALS USA CORP. 2004-08-26 US disclosed