SCHEMBL4860941

SCHEMBL4860941

Cc1ccc(O)c2c1OCO2

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 4/20 0.38
MAOA P21397 3/20 0.38
DRD2 P14416 3/20 0.37
DRD3 P35462 3/20 0.37
DRD1 P21728 2/20 0.37
HTR2A P28223 2/20 0.37
DRD4 P21917 1/20 0.37
AOC3 Q16853 1/20 0.37
ESR1 P03372 3/20 0.36
ESR2 Q92731 3/20 0.36
TP53 P04637 2/20 0.34
TDP1 Q9NUW8 1/20 0.34
SIGMAR1 Q99720 1/20 0.33
TSHR P16473 1/20 0.32
CASP1 P29466 1/20 0.32
PDE10A Q9Y233 1/20 0.32
NQO2 P16083 1/20 0.32
KDM4E B2RXH2 1/20 0.32
MGAM O43451 1/20 0.32
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11358607 0.86 DRD2 (0.49) MAOBMAOADRD2DRD3DRD1
SCHEMBL6127806 0.85 NQO2 (0.37) TSHRNQO2
SCHEMBL2265157 0.85 AOC3 (0.44) DRD2DRD3DRD1HTR2ADRD4
SCHEMBL17662577 0.74 NPC1 (0.36) NQO2ALDH1A1
SCHEMBL8462173 0.73
SCHEMBL13925013 0.73 NQO2 (0.34) NQO2
SCHEMBL4492757 0.73 CYP3A4 (0.34) TP53TDP1TSHRCASP1NQO2
SCHEMBL19122315 0.73 NQO2 (0.32) NQO2
SCHEMBL20392875 0.73 AOC3 (0.37) AOC3NQO2ALDH1A1
SCHEMBL15688428 0.73 AOC3 (0.37) DRD2DRD3DRD1HTR2ADRD4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008151063-A2 HIGH DEFINITION VERSATILE STEREOLITHIC METHOD AND MATERIAL MEISNER MILTON (US) 2008-12-11 WO claimed
US-7183361-B2 Include crystalline polymers wherein crystallinity is provided by a linear long chain aliphatic carboxylic acid on a base polymer; polymers can either have a hyperbranched or dendritic structure or have a comb-like structure REICHHOLD, INC. (US) 2007-02-27 US claimed
EP-1685167-A4 RHEOLOGY MODIFYING AGENTS AND METHODS OF USING THE SAME REICHHOLD INC (US) 2006-12-27 EP claimed
EP-1685167-A2 RHEOLOGY MODIFYING AGENTS AND METHODS OF USING THE SAME Reichhold, Inc. (US) 2006-08-02 EP claimed
WO-2005030809-A2 RHEOLOGY MODIFYING AGENTS AND METHODS OF USING THE SAME REICHHOLD, INC. (US) 2005-04-07 WO claimed
US-20050069799-A1 Rheology modifying agents and methods of using the same REICHHOLD, INC. 2005-03-31 US claimed
US-5439766-A Cationically polymerized epoxy based coating combined with conventional epoxy glass substrate INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1995-08-08 US claimed
EP-3916062-B1 METHOD AND APPARATUS FOR ADHESIVE DEPOSITION ZEPHYROS INC (US) 2024-11-06 EP disclosed
EP-3916062-A1 METHOD AND APPARATUS FOR ADHESIVE DEPOSITION Zephyros Inc. (US) 2021-12-01 EP disclosed
EP-2880113-B1 METHOD AND APPARATUS FOR ADHESIVE DEPOSITION ZEPHYROS INC (US) 2021-06-30 EP disclosed
EP-3086940-A2 TOUGHENED COMPOSITE MATERIALS AND METHODS OF MANUFACTURING THEREOF Cytec Industries Inc. (US) 2016-11-02 EP disclosed
US-9422458-B2 Method and apparatus for adhesive deposition ZEPHYROS, INC. (US) 2016-08-23 US disclosed
US-20150174872-A1 TOUGHENED COMPOSITE MATERIALS AND METHODS OF MANUFACTURING THEREOF CYTEC INDUSTRIES INC 2015-06-25 US disclosed
US-6040631-A Method of improved cavity BGA circuit package INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2000-03-21 US disclosed
US-5439766-A Cationically polymerized epoxy based coating combined with conventional epoxy glass substrate INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1995-08-08 US disclosed
US-5439766-A Cationically polymerized epoxy based coating combined with conventional epoxy glass substrate INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1995-08-08 US disclosed
US-5112715-A Toner compositions containing a multi-purpose additive EASTMAN KODAK COMPANY (US) 1992-05-12 US disclosed
EP-0162698-B1 SOLDERABLE CONDUCTIVE COMPOSITIONS, METHODS FOR THEIR PREPARATION, AND SUBSTRATES COATED WITH THEM ELECTRO MATERIALS CORP. OF AMERICA (US) 1990-04-25 EP disclosed
EP-0162698-A1 Solderable conductive compositions, methods for their preparation, and substrates coated with them ELECTRO MATERIALS CORP. OF AMERICA (US) 1985-11-27 EP disclosed
US-4548879-A Solderable polymer thick films ROHM AND HAAS COMPANY (US) 1985-10-22 US disclosed